Data Sheet

SBC324 - 3U OpenVPX 2
nd
Generation Intel Core based Single Board Computer
Specifications
Processor
Intel 2
nd
Gen. Core i7 Processor, options include
but are not limited to
-
i7-2715QE (Quad core) @ 2.1 GHz (45W)
-
i7-2655LE (Dual core) @, 2.2 GHz (25W)
-
i7-2610UE (Dual core) @, 1.5 GHz (17W)
(Actual speed/power depends on
environment)
32nm monolithic die processing technology
Last Level Cache
- 6 MB (Quad i7)
- 4 MB (Dual i7)
SDRAM
Maximum memory configuration of up to 8 GB
DDR3 SDRAM @ 1333 MHz soldered with ECC
Flash Memory
Soldered NAND flash array up to 32 GB
Ethernet
Dual Gigabit Ethernet interface via Intel’s 82574
Gigabit Ethernet controllers – routed to VPX P1
USB Ports
Up to 4x USB 2.0 ports routed to VPX P1
2x ports available if GPIO and PS/2 are utilized
Fabric Interface
Allows high speed PCI Express connections to
other cards in the system
-
x4 PCIe VPX P1; DMA and configurable as
Non-Transparent (NTB) for peer-to-peer
capability
-
x4 / x16 PCIe (split across P1/P2), x16
available without XMC
-
Also GEN 1 x1 PCIe
Keyboard and Mouse
1x PS/2 port routed to P1, multiplexed signal
with GPIO
OpenVPX Profile
Module Profile: MOD3-PAY-2F2T-16.2.5-3
Module Profile: MOD3-PAY-2F-16.2.7-1
Serial Ports
Two 16550 compatible full duplex async serial
ports
-
COM1 routed to VPX P1 RS-232/422
-
COM2 routed to VPX P2 RS-232/422
Ports feature independent 16-byte FIFO
supporting baud rates up to 115 Kbaud
Serial ATA
2x SATA Revision 3.0 capable (6 Gb/s)
One routed to VPX P1; the other to VPX P2
SATA port on P2 is a multiplexed signal with
XMC IO
Audio
High Definition Audio Codec
Stereo line in and stereo line out
Video Controller
1x VGA port routed to VPX P2; multiplexed
signal with XMC IO
General Purpose I/O
Up to 6x GPIO (P1 rear IO), TTL 5V tolerant GPIO
each capable of generating an interrupt.
Environmental
Level 1 Level 2 Level 3 Level 4 Level 5
Cooling Method Convection Convection Convection Conduction Conduction
Conformal Coating Optional Standard Standard Standard Standard
High/Low Temp 0 to +55° C -20 to +65° C -40 to +75° C -40 to +75° C -40 to +85° C
Operational (300 ft/m) (300 ft/m) (600 ft/m) At cold wall At cold wall
Random Vibration 0.002g
2
/Hz* 0.002g
2
/Hz* 0.04g
2
/Hz** 0.1g
2
/Hz** 0.1g
2
/Hz**
Shock 20g*** 20g*** 20g*** 40g*** 40g***
* With a flat response to 1000 Hz, 6 dB/Oct roll-off from 1000 to 2000 Hz ** From 10 to 1000 Hz *** Peak sawtooth 11 ms duration
Note: Processor performance and temperature are inter-dependent. For a given temperature, a maximum processor
speed is achievable, and conversely for a given processor speed, a maximum temperature is achievable. Consult the
product manual for details.
About GE Intelligent Platforms
GE Intelligent Platforms, a General Electric Company (NYSE: GE), is an experienced high-performance technology
company and a global provider of hardware, software, services, and expertise in automation and embedded
computing. We offer a unique foundation of agile, advanced and ultra-reliable technology that provides customers
a sustainable advantage in the industries they serve, including energy, water, consumer packaged goods,
government and defense, and telecommunications. GE Intelligent Platforms is a worldwide company
headquartered in Charlottesville, VA and is part of GE Home and Business Solutions. For more information, visit
defense.ge-ip.com.
GE Intelligent Platforms Contact Information
Americas: 1 800 433 2682 or 1 434 978 5100
Global regional phone numbers are listed by location on our web site at defense.ge-ip.com.
defense.ge-ip.com
©2012 GE Intelligent Platforms. All Rights Reserved.
All other brands or names are property of their respective holders.
Specifications are subject to change without notice.
08.12 GFA-1777
XMC Expansion Slot
x8 PCIe XMC site (P2 rear IO)
8 differential pairs, plus 12 differential pairs,
plus 24 single-end signals
NVRAM / RTC / Watchdog / ETI / TPM / BMM
512kB non-volatile RAM (MRAM)
Real-time clock in CPLD (software
programmable)
Watchdog timer (software programmable)
Elapsed Time Indicator (record power cycles
and on-time)
TPM (Trusted Platform Module)
Baseboard Management Controller
LED
1x power
4x BIT status (software control)
Power Requirements
+5V / 3.3V required
+/-12V for XMC/PMC module only
Temperature Sensor
Onboard ambient temperature; CPU
Note: The SBC324 is designed to provide flexibility and scalability to
the user. Use of the XMC I/O affects the availability of other I/O
features. Due to the nature of multiplexed signals, I/O
configurations also may be limited. Please contact your GE
Intelligent Platforms representative for viable configurations.
SBC324-xxxx0xxx SBC324-xxxx1xxx
XMC IO 1 -
x16 PCIe - 1
x4 PCIe 2 1
x1 PCIe - 1
COM 2 2
USB 2
Either / or
2
K / M - 1
GigE 2 1
Audio - 1
SATA 1 2
VGA - 1
GPIO 6 2