Operating Manual

nanome|x – the ultimate X-ray solution

This automatic X-ray system of superior specifications satisfies even highest demands for the

inspection of high-end interconnections in the semiconductor and SMT industry. The high-per-

formance nanofocus tube (4-in-1) covers the full range from submicron resolution to high-inten-

sity applications. The digital realtime image chain provides an excellent contrast resolution and

enables oblique views up to 70 degrees and magnifications well above 24 000x. The nanome|x

offers unique performance and versatility and can be used for 2D X-ray inspection as well as for

full 3D computed tomography. With the new x|act software package the nanome|x is the system

of choice to ensure meeting actual and future zero defect requirements.

Setting new standards

 180 kV / 15 W high-power nanofocus tube

 2-Megapixel digital image chain

 24” TFT monitor

 x|act software package: easy and fast CAD based programming for high-

resolution automated X-ray inspection (µAXI) with high magnification and

repeatability

 Outstanding ease-of-use

 Detail detectability down to 0.2 microns

 Optical zoom up to 24 000x

 Oblique views at angles between 0 and 70 degrees

 Dual detector (digital image chain and active temperature-stabilized digital

detector with 30 fps) for brilliant live images

 4-Megapixel digital image chain available

 Upgradeable to nanoCT

nanoCT

of CSP solder joints

BGA: insucient reow

QFN: two open joints

nanoCT

of stacked dies

Wedge-bond

Cracked die

Measurement & Control Solutions

phoenix|x-ray

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GE Measurement & Control Solutions phoenix|x-ray nanome|x – the ultimate X-ray solution This automatic X-ray system of superior specifications satisfies even highest demands for the inspection of high-end interconnections in the semiconductor and SMT industry. The high-performance nanofocus tube (4-in-1) covers the full range from submicron resolution to high-intensity applications.
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GE Measurement & Control Solutions phoenix|x-ray nanofocus X-ray inspection of high-end interconnections Electronic packages are sophisticated electronic devices with complex, internal features. In order to meet the quality requirements of the industry, X-ray inspection solutions must not only be capable of delivering detail detectabilities in the submicron range but also of detecting hidden defects and flaws.