Brochure

Automated Inspection
E cient soldering process control requires the acquisition of statistical data on the solder joints of a larger number of samples.
phoenix|x-ray o ers a range of plug-in software modules for the automatic evaluation of standard solder joints like BGA, QFP,
QFN, or PTH. For non-typical interconnections, appropriate modules can quickly be customized with the XE² (X-ray image Evalu-
ation Environment) software. Together with the high precision CNC manipulation, which comes standard with phoenix|x-ray
systems these modules enable the automatic X-ray inspection (AXI) of solder joints at minimum set-up time, due to teach-in
programming and auto-setup routines. An additional software package – quality|review – is the perfect connection to rework.
phoenix|x-ray's inspection modules can also easily be activated during manual inspection as a quick inspection aid.
Software for the automated X-ray analysis of
microscopic solder joints, even with back-
ground structures present. The analysis runs
fully automated and is extremely time-sav-
ing.
The following c4-parameters can be in-
spected:
Missing solder balls
Void size
Void percentage
Number of voids
Software designed for the automated void-
ing analysis of die-attach and planar solder
joints with versatile set-up options:
Calculation of the total voiding percent-
age
Calculation of the void count
Sorting voids according to variable
thresholds
De nition of hot zones
Calculation of the minimum void diameter
Calculation of die tilt and rotation
Automated die inspection
Dimple solder joint correction
Inspection and analysis of multiple-die
packages
The radiation dose typically used in
X-ray inspection is only a thousandth
of the dose rate that would cause da-
mage to semiconductor components.
phoenix|x-ray provides a variety of op-
tions for controlling and adjusting the
dose rate e.g.:
low-dose|mode
automated inspection routines (AXI)
collimated beams
self- ltering target
As a solution for AXI with highest defect cov-
erage, phoenix|x-ray provides calibrated high
precision o ine AXI systems including the
unique x|act software package for fast and
easy o ine CAD-programming. Small views
with highest resolution of a few micrometers,
360° rotation and oblique viewing up to 70°
ensure to meet highest quality standards.
Among the automated X-ray inspection, the
AXI system can be used for manual failure
analysis or 3D computed tomography as
well.
The efficient way of process control and rework: AXI
c4|module
flip-chip inspection
x|act
AXI with highest defect coverage
vc|module
voiding calculations
Technology
Multiple-die attach evaluation