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The View Inside
What can X-ray inspection tell us about package quality?
Any internal details such as bond wires, inner and outer bonds, die,
die attach, lead frame and moulding can be examined for defects (e.g.
broken wires, excessive wire sweep, extraneous or crossing wires, die
attach voids and die tilt, die cracks, defective lid seals, moulding voids,
entrapped particles and delaminations).
Chip-scale package in top-down view (not balled yet)
The image gives a clear view of the integrity of the vias and lead tracks of
the PCB and the quality of the solder joints.
Wire-bonded area array packages:
PBGA, CSP, etc.
Standard IC packages: DIP, SOT, VSOP, (P)LCC,
QFP, Flat Pack
FC-bonded IC, top-down view
Applications include the inspection of microscopic solder joints connec-
ting IC and ceramic substrate as well as underfi ll inspection. The most
common defects are open solder joints, missing solder joints, solder
bridges, solder and underfi ll voids.
Flip-chip bonded area array packages:
CBGA etc.
Electronic packages are sophisticated electronic devices with complex, internal features. In order to meet the quality require-
ments of the industry, X-ray inspection solutions must be capable of delivering detail detectabilities in the submicron range and
detecting hidden defect fl aws.
phoenix|x-ray o ers automated microfocus and nanofocus X-ray inspection solutions for any package inspection task including,
but not limited to the following:
IC-package, top-down view
Wedge-bond inspection
Wire destroyed by overvoltage
Cracked wire
Bridge between flip-chip
bonds
Shape deviations and opens
in flip-chip bonds
Die attach
voids
Cracked die
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Ball-bond inspection
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