Brochure

Anticipating the Future
Technology
What is the difference between
nanofocus and microfocus tubes?
Although the
focal spot of
microfocus tubes
is as small as 3
microns, it is still
large enough
to cause a half
shadow, known
as the penumbra
microfocus system nanofocus system
effect. This results in a residual unsharp-
ness and can be avoided by using nanofo-
custechnology.Nanofocusprovidesfocal
spots well below one micron while main-
taining the highest intensity needed.
source
object
detector
Miniaturization and new assembly tech-
niques demand resolution in the sub-
micron range and also highest contrast
resolution. With the nanofocus tube tech-
nology together with digital image chains
or fully digital detector arrays,
phoenix|x-ray provides proven detail
detectability down to 200 nm (0.2 microns)
combined with superior contrast reso-
lution. In this way fine details and slight
variations in thickness, such as those
caused by tiny voids in microscopic Flip
Chip solder joints are detected.
The combination of phoenix|x-ray's high-power nanofocus
X-ray tube and optimized reconstruction software enables
unprecedented nanoCT
®
image resolution and quality. This
technology allows the inspection and 3-dimensional visualiza-
tion of the internal details of smaller specimens with submi-
crometer voxel resolution.
The image quality is essential for an optimal defect coverage of all
2D and 3D inspection tasks. Due to its high dynamic, the new active
temperature stabilized GE DXR digital detector arrays ensure a very
low noise fast and detailed live inspection with up to 30 frames per
second at full resolution. This makes it possible to run a 3D CT scan
within only 10 seconds.
nanoCT
®
of a BGA ball with cracks of 1‑8 µm
Open BGA with head‑in‑pillow‑effect;
metallic dendrites visible in the eutectic matrix
Inspecting the smallest and finest
nanofocus and digital imaging
High dynamic digital detectors
Active temperature stabilization
High-resolution 3D-imaging
nanoCT
®
Technology
phoenix|x-ray systems help you
meet the standards
The phoenix|x-ray solder joint inspection
software modules include all X-ray acces-
sible criteria mentioned in the commonly
applied standards for acceptability of PCB
assemblies, namely:
• IPC-A-610 Revision E
• IPC 7095
The modules are continuously updated to
adapt them to revisions of the standards.
40 micron solder bumps at
nanofocus
resolution
40 micron solder bumps at
microfocus resolution