User's Manual
Table Of Contents
- Table of Contents
- Chapter 1 GS2100M Overview
- Chapter 2 GS2100M Architecture
- Chapter 3 Pin-out and Signal Description
- Chapter 4 Electrical Characteristics
- Chapter 5 Package and Layout Guidelines
Package and Layout Guidelines GS2100M Low Power WiFi Module Data Sheet
GS2100Mxx Recommended PCB Footprint and Dimensions
52 Confidential Preliminary GS2100M-DS-001212, Release 0.10
5. If the temperature is too low, non-melting tends to be caused in the area with
large heat capacity after reflow.
6. Be careful about sudden rise in temperature as it may worsen the slump of
solder paste.
7. Be careful about slow cooling as it may cause the positional shift of parts and
decline in joining at times.
8. A no clean flux should be used during SMT process.
Note: The modules are shipped in sealed trays with the following conditions (see
Figure 7, page 52).
Figure 7 Module Moisture Conditions