User's Manual

GS2100M Low Power WiFi Module Data Sheet Package and Layout Guidelines
GS2100Mxx Recommended PCB Footprint and
GS2100M-DS-001212, Release 0.10 Confidential Preliminary 51
5.1.1 Surface Mount Assembly
The reflow profile is shown in Figure 6, page 51. The recommended reflow parameters are
summarized in Table 17, page 51.
Figure 6 Reflow Temperature Profile
Note:
1. Perform adequate test in advance as the reflow temperature profile will vary
according to the conditions of the parts and boards, and the specifications of the
reflow furnace.
2. Max number of reflow supported are two.
3. Be careful about rapid temperature rise in preheat zone as it may cause
excessive slumping of the solder paste.
4. If the preheat is insufficient, rather large solder balls tend to be generated.
Conversely, if performed excessively, fine balls and large balls will generate in
clusters at a time.
Table 17 Recommended Reflow Parameters
PreHeat
Temperature Ramp up rate for (A)
2
1.5~3.5
o
C/s
Pre-heat time (B)
3
80 to 130 seconds
Pre-heat ending temperature (C)
4
Heating
5
Peak Temperature range (D) 240 to 250
o
C
Melting time that is the time over 220
o
C (E) 50 to 75 seconds
Cool Down Ramp (F) >2
o
C/s