User's Manual

GS2100M Low Power WiFi Module Data Sheet Package and Layout Guidelines
GS2100Mxx Recommended PCB Footprint and
GS2100M-DS-001212, Release 0.8 Confidential Preliminary 53
6. Be careful about sudden rise in temperature as it may worsen the slump of solder paste.
7. Be careful about slow cooling as it may cause the positional shift of parts and decline in
joining at times.
8. A no clean flux should be used during SMT process.
The modules are shipped in sealed trays with the following conditions (see Figure 7,
page 53).
Figure 7 Module Moisture Conditions
XYZ Printing 20140722