User's Manual

Package and Layout Guidelines GS2100M Low Power WiFi Module Data Sheet
GS2100Mxx Recommended PCB Footprint and Dimensions
52 Confidential Preliminary GS2100M-DS-001212, Release 0.8
5.1.1 Surface Mount Assembly
The reflow profile is shown in Figure 6, page 52. The recommended reflow parameters are
summarized in Table 17, page 52.
Figure 6 Reflow Temperature Profile
Notes:
1. Perform adequate test in advance as the reflow temperature profile will vary according to the
conditions of the parts and boards, and the specifications of the reflow furnace.
2. Max number of reflow supported are two.
3. Be careful about rapid temperature rise in preheat zone as it may cause excessive slumping
of the solder paste.
4. If the preheat is insufficient, rather large solder balls tend to be generated. Conversely, if
performed excessively, fine balls and large balls will generate in clusters at a time.
5. If the temperature is too low, non-melting tends to be caused in the area with large heat
capacity after reflow.
Table 17 Recommended Reflow Parameters
Preheat
Temperature Ramp up rate for (A)
2
1.5~3.5
o
C/s
Pre-heat time (B)
3
80 to 130 seconds
Pre-heat ending temperature (C)
4
Heating
5
Peak Temperature range (D) 240 to 250
o
C
Melting time that is the time over 220
o
C (E) 50 to 75 seconds
Cool Down Ramp (F) >2
o
C/s
XYZ Printing 20140722