User's Manual

Package and Layout Guidelines GS2100M Low Power WiFi Module Data Sheet
GS2100Mxx Recommended PCB Footprint and Dimensions
50 Confidential Preliminary GS2100M-DS-001212, Release 0.8
Figure 5 GS2100MIx Module Dimensions (in millimeters)
Notes:
1. All Dimensions are in millimeters (mm). Tolerances TBD.
2. Absolutely no metal trace or ground layer underneath this area. If using ceramic antenna, it
is recommended to have only air under this area. Hang antenna over edge of base board or
cut notch in base board.
3. The 3 RF shield mounting holes and 2 test fixture alignment holes (circled in red in Figure
4, page 49
and Figure 5, page 50) have exposed metal. These areas must not have metal
on the customer board.
4. For best RF performance, we recommend:
– Using power and GND planes up to the edge of the module, but having no metal under the
module (planes or signal).
– Using at least 3 vias when either power or GND changes layers. This applies particularly
at the module GND pins and at the VIN_3V3 pins.
– Providing a 10 uF capacitor at the VIN_3V3 pin.
– Keep high speed signals away from RF areas of module.
5. In performing SMT or manual soldering of the module to the base board, first align the row
of pins from #15 through #26 onto the base board and then match the other two rows.
In addition to the guidelines, note the following suggestions:
1. External Bypass capacitors for all module supplies should be as close as possible to the
module pins.
2. Never place the antenna very close to metallic objects.
XYZ Printing 20140722