System information

RX2520 M1
Upgrade and Maintenance Manual 225
Processors
11.6 Applying thermal paste
I For the Japanese market, the service engineer must follow the
instruction provided separately.
If the processor upgrade or replacement kit contains a new CPU heat
sink, a thin layer of thermal compound has already been pre-applied
to its lower surface. In this case, please proceed with section
"Installing processor heat sinks" on page 219.
Figure 124: Thermal paste syringe TC-5026
One thermal compound syringe (A3C40142460 / 34035576) contains thermal
paste for three processors.
Field Replaceable Unit
(FRU)
Hardware: 5 minutes
Tool: tool-less