FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-26015-1E F2MC-8FX Family LQFP-52P (0.
PREFACE Thank you for purchasing the LQFP-52P (0.65 mm pitch) *1 header board (model number : MB2146-261) for the F2MC *2 -8FX family. MB2146-261 is a header board used to connect the MCU board (model number : MB2146-301, MB2146-303) which mounts the F2MC-8FX family evaluation MCU to a user system. This manual explains the handling of the MB2146-261. Before using MB2146-261, be sure to read this manual.
• The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. • The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU semiconductor device; FUJITSU does not warrant proper operation of the device with respect to use based on such information.
1. Product Outline ■ Product outline MB2146-261 is a header board (referred to as header board) used to connect the MCU board (model number : MB2146-301, MB2146-303) which mounts an evaluation MCU in the F2MC-8FX family of Fujitsu 8-bit microcontrollers to a user system. To build an F2MC-8FX evaluation environment, combine the three products as shown in Figure 1: the header board, a MCU board, and a BGM adapter (model number : MB2146-09).
2. Checking the Delivered Product Before using the MB2146-261, confirm that the following components are included in the box: • LQFP-52P (0.65 mm pitch) header board *1 :1 • Screws for securing header board (M2 × 10 mm, 0.4 mm pitch) :4 2 • NQPACK052SB * :1 • HQPACK052SB *3 :1 • Operation manual (English version, this manual) :1 *1 : Header board manufactured by Tokyo Eletech Corporation, referred to as “YQPACK”, mounts YQPACK052SB.
4. Notes on Designing ■ Notes on designing printed circuit board for the user system When the header board is connected to the user system, some part mounted around the NQPACK in the user system may be contacting the header board if the height of the part is tall. To prevent this, design the printed circuit board for the user system so that the components do not exceed the height shown in Figure 2. Figure 2 shows the dimension figure of the header board. PCW-1-1-1PW :MAC EIGHT 40.0 mm 30.
■ MCU footprint design notes Figure 3 shows the recommended footprint dimensions of the NQPACK mounted on the printed circuit board for the user system. Take the footprint in Figure 3 into consideration as well as the footprint of the mass production MCU when designing the printed circuit board for the user system. To follow the most updated information, be sure to contact Tokyo Eletech Corporation whenever designing the printed circuit board. 0.4 mm 2.0 mm 0.
5. Connecting to the User System ■ Connecting Mount the supplied NQPACK on the user system before using the MB2146-261. 27 13 52 14 40 26 39 1 1. To connect the header board to the user system, match pin 1 indicated by the index mark (▲) on the NQPACK mounted on the user system with pin 1 indicated by the index mark (an angle cut linearly at one place only in silk screen) on the header board and then insert it (see “Figure 4”) . The pins of YQPACK are thin and easy to bend.
MCU board Evaluation MCU MCU board Screws for securing header board Header board Connected at shipment YQPACK NQPACK User system Figure 5 Connecting MCU Board/Header Board to User System ■ Disconnection 1. Remove the MCU board from the header board. Detach the four corners slowly in sequence, not excessively forcing the junction with the NQPACK. 2. Remove all of the four screws from the header board. Pull out the header board vertically from the NQPACK.
6. Mounting Mass Production MCUs ■ Mounting To mount a mass production MCU on the user system, use the supplied HQPACK (IC socket cover) (see “Figure 6”) . 1. To mount a mass production MCU on the user system, match the index mark (▲) on the NQPACK mounted on the user system with the index mark (●) on the mass production MCU. 2. Confirm that the mass production MCU is correctly mounted on the NQPACK.
7. Product Specifications ■ General specifications Table 3 lists the general specifications of the header board. Table 3 General Specifications Item Description Operating temperature and storage temperature 5 °C to 35 °C (operation) , 0 °C to 40 °C (storage) Operating humidity and storage humidity 20 % to 80 % (operation) , 20 % to 80 % (storage) Dimensions Approximately 40 mm × 40 mm × 16 mm (Height contains that of YQPACK and NQPACK) ■ Main part The main part of a header board is shown in Table 4.
■ MCU board I/F connector (CN1, CN2, and CN3) CN1 and CN2 are MCU board I/F connectors. CN3 is the incorrect insertion prevention socket of a MCU board. The pin assignment of the MCU board I/F connector CN1 is shown in Table 5, and the pin assignment of the MCU board I/F connector CN2 is shown in Table 6.
Table 6 Pin Assignment of the MCU Board I/F Connector CN2 Connector Evaluation MCU Pin Pin Number Number 10 Signal name Connector Evaluation MCU Pin Pin Number Number Signal name Connector Evaluation MCU Pin Pin Number Number Signal name 1 A10 PC5 41 E17 NC4 81 P16 P34 2 B10 PD0 42 E18 SEL0 82 P15 P35 3 C10 PC6 43 F15 SEL3 83 R18 P44 4 D10 PC7 44 F16 SEL4 84 R17 P36 5 A11 PD1 45 F17 SEL1 85 R16 P31 6 B11 PD2 46 F18 P04C 86 R15 AVcc3 7 C11 PD3 4
■ User system I/F YQPACK (U1) The pin assignment of user system I/F YQPACK in the header board is shown in Table 7.
SS01-26015-1E FUJITSU SEMICONDUCTOR • SUPPORT SYSTEM F2MC-8FX Family LQFP-52P (0.65 mm pitch) HEADER BOARD MB2146-261 OPERATION MANUAL April 2006 the first edition Published FUJITSU LIMITED Electronic Devices Edited Business Promotion Dept.
