Datasheet

6
FTR-K1 SERIES
JS SERIES
1. General Information
l All relays produced by Fujitsu Components are compliant with RoHS directive 2011/65/EU including
amendments.
l Cadmium as used in electrical contacts is exempted from the RoHS directives.
As per Annex III of directive 2011/65/EU.
l All relays are lead-free. Please refer to Lead-Free Status Info for older date codes at:
http://www.fujitsu.com/downloads/MICRO/fcai/relays/lead-free-letter.pdf
l Lead free solder plating on relay terminals is Sn-3.0Ag-0.5Cu, unless otherwise specified.
This material has been verified to be compatible with PbSn assembly process.
2. Recommended Lead Free Solder Condition
l Recommended solder Sn-3.0Ag-0.5Cu.
RoHS Compliance and Lead Free Information
3. Moisture Sensitivity
l Moisture Sensitivity Level standard is not applicable to electromechanical relays, unless otherwise indicated.
4. Tin Whiskers
l Dipped SnAgCu solder is known as presenting a low risk to tin whisker development. No considerable length
whisker was found by our in house test.
We highly recommend that you conrm your actual solder conditions
Flow Solder condition:
Pre-heating: maximum 120˚C
Soldering: dip within 5 sec. at
260˚C solder bath
Solder by Soldering Iron:
Soldering Iron
Temperature: maximum 360˚C
Duration: maximum 3 sec.