Datasheet

Dual-Core Intel
®
Xeon
®
Processor 5100 Series Datasheet 79
Thermal Specifications
Notes:
1. Please refer to Table 6-7 for discrete points that constitute the thermal profile.
2. Refer to the Dual-Core Intel
®
Xeon
®
Processor 5100 Series Thermal/Mechanical Design Guidelines for
system and environmental implementation details.
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Please refer to the loadline specifications in Section 2.
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3. These specifications are based pre-silicon estimates and simulations. These specifications will be updated
with characterized data from silicon measurements in a future release of this document.
4. Power specifications are defined at all VIDs found in Table 2-3. The processor may be shipped under
multiple VIDs for each frequency.
Figure 6-3. Dual-Core Intel® Xeon® Processor LV 5148 and Dual-Core Intel® Xeon®
Processor LV 5128 Thermal Profile
TCASE_MAX@TDP
45
47
49
51
53
55
57
59
20 22 24 26 28 30 32 34 36 38 40
Power [W]
Temperature [C]
Y = 0.450*x +40.0
TCASE_MAX@TDP
45
47
49
51
53
55
57
59
20 22 24 26 28 30 32 34 36 38 40
Power [W]
Temperature [C]
Y = 0.450*x +40.0
Table 6-7. Dual-Core Intel® Xeon® Processor LV 5148 and Dual-Core Intel® Xeon®
Processor LV 5128 Thermal Profile Table
Power (W) T
CASE_MAX
(°C)
P
_PROFILE_MIN
=22.2 50.0
25 51.3
30 53.5
35 55.8
40 58.0
Table 6-8. Dual-Core Intel® Xeon® Processor 5160 Thermal Specifications
Core
Frequency
Maximum
Power
(W)
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB 90 65 5 See Figure 6-4;
Table 6-9;
Table 6-10
1, 2, 3, 4, 5, 6,
7