Datasheet

Thermal Specifications
78 Dual-Core Intel
®
Xeon
®
Processor 5100 Series Datasheet
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Please refer to the loadline specifications in Section 2.
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3. These specifications are based pre-silicon estimates and simulations. These specifications will be updated
with characterized data from silicon measurements in a future release of this document.
4. Power specifications are defined at all VIDs found in Table 2-3. The Dual-Core Intel® Xeon® Processor LV
5148 may be shipped under multiple VIDs for each frequency.
5. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements
Table 6-4. Dual-Core Intel® Xeon® Processor LV 5138 Nominal Thermal Profile Table
Power (W) T
CASE_MAX
(°C)
P
_PROFILE_MIN_NOMINAL
=6.8 50.0
10 52.4
15 56.1
20 59.7
25 63.4
30 67.1
35 70.8
Table 6-5. Dual-Core Intel® Xeon® Processor LV 5138 Short Term Thermal Profile Table
Power (W) T
CASE_MAX
(°C)
P
_PROFILE_MIN_SHORT-TERM
=0 60.0
5 63.7
10 67.4
15 71.1
20 74.7
25 78.4
30 82.1
35 85.8
Table 6-6. Dual-Core Intel® Xeon® Processor LV 5148 and Dual-Core Intel® Xeon®
Processor LV 5128 Thermal Specifications
Processor
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
5148 40 5 See Figure 6-3;
Table 6-7;
1, 2, 3, 4, 5
5128 40 5 See Figure 6-3;
Table 6-7;
1, 2, 3, 4, 5