Datasheet

Dual-Core Intel
®
Xeon
®
Processor 5100 Series Datasheet 75
Thermal Specifications
The upper point of the thermal profile consists of the Thermal Design Power (TDP)
defined in Table 6-8 and the associated T
CASE
value. It should be noted that the upper
point associated with Thermal Profile B (x = TDP and y = T
CASE_MAX
B @ TDP)
represents a thermal solution design point. In actuality the processor case temperature
will not reach this value due to TCC activation (see Figure 6-4). The lower point of the
thermal profile consists of x = P
_PROFILE_MIN
and y = T
CASE_MAX
@ P
_PROFILE_MIN
.
P
_PROFILE_MIN
is defined as the processor power at which T
CASE
, calculated from the
thermal profile, is equal to 50°C.
Analysis indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
Table 6-1instead of the maximum processor power consumption. The Thermal Monitor
feature is intended to help protect the processor in the event that an application
exceeds the TDP recommendation for a sustained time period. For more details on this
feature, refer to Section 6.2. To ensure maximum flexibility for future requirements,
systems should be designed to the Flexible Motherboard (FMB) guidelines, even if a
processor with lower power dissipation is currently planned. The Thermal Monitor
and Enhanced Thermal Monitor features must both be enabled in BIOS for the
processor to be operating within specifications.
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Please refer to the loadline specifications in Section 2.
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3. These specifications are based pre-silicon estimates and simulations. These specifications will be updated
with characterized data from silicon measurements in a future release of this document.
4. Power specifications are defined at all VIDs found in Table 2-3.
5. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirement.
6. This applies to the Dual-Core Intel® Xeon® Processor 5160 beginning with the G-step. The B-step
specifications can be found in Table 6-8.
Table 6-1. Dual-Core Intel® Xeon® Processor 5100 Series Thermal Specifications
Core
Frequency
Maximum
Power
(W)
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
5110 through
5150
80 65 5 See Figure 6-1;
Table 6-2
1, 2, 3, 4, 5, 6
5160 80 65 5 See Figure 6-1;
Table 6-2
1, 2, 3, 4, 5, 6,
7