Datasheet
Dual-Core Intel
®
Xeon
®
Processor 5100 Series Datasheet
5
6-2 Dual-Core Intel® Xeon® Processor LV 5138
Nominal & Short-Term Thermal Profiles................................................................77
6-3 Dual-Core Intel® Xeon® Processor LV 5148 and
Dual-Core Intel® Xeon® Processor LV 5128 Thermal Profile ...................................79
6-4 Dual-Core Intel® Xeon® Processor 5160 Thermal Profiles A and B ..........................80
6-5 Case Temperature (TCASE) Measurement Location ................................................82
6-6 Thermal Monitor 2 Frequency and Voltage Ordering ...............................................84
6-7 PECI Topology ..................................................................................................87
6-8 Temperature Data Format Comparison: Thermal Diode vs. PECI Digital
Thermal Sensor.................................................................................................88
7-1 Stop Clock State Machine...................................................................................94
8-1 Boxed Dual-Core Intel
®
Xeon
®
Processor 5100 Series
1U Passive/3U+ Active Combination Heat Sink (With Removable Fan) ......................97
8-2 Boxed Dual-Core Intel
®
Xeon
®
Processor 5100 Series 2U Passive Heat Sink.............. 98
8-3 2U Passive Dual-Core Intel
®
Xeon
®
Processor 5100 Series
Thermal Solution (Exploded View) .......................................................................98
8-4 Top Side Board Keepout Zones (Part 1).............................................................. 100
8-5 Top Side Board Keepout Zones (Part 2).............................................................. 101
8-6 Bottom Side Board Keepout Zones..................................................................... 102
8-7 Board Mounting-Hole Keepout Zones ................................................................. 103
8-8 Volumetric Height Keep-Ins .............................................................................. 104
8-9 4-Pin Fan Cable Connector (For Active CEK Heat Sink) ......................................... 105
8-10 4-Pin Base Board Fan Header (For Active CEK Heat Sink)...................................... 106
8-11 Fan Cable Connector Pin Out for 4-Pin Active CEK Thermal Solution ....................... 108
Table
1-1 Dual-Core Intel
®
Xeon
®
Processor 5100 Series......................................................12
2-1 Core Frequency to FSB Multiplier Configuration .....................................................19
2-2 BSEL[2:0] Frequency Table ................................................................................19
2-3 Voltage Identification Definition...........................................................................21
2-4 Voltage Identification Definition...........................................................................22
2-5 Loadline Selection Truth Table for LL_ID[1:0] .......................................................23
2-6 Market Segment Selection Truth Table for MS_ID[1:0]...........................................23
2-7 FSB Signal Groups.............................................................................................24
2-8 AGTL+ Signal Description Table...........................................................................25
2-9 Non AGTL+ Signal Description Table....................................................................25
2-10 Signal Reference Voltages ..................................................................................25
2-11 PECI DC Electrical Limits ....................................................................................26
2-12 Processor Absolute Maximum Ratings...................................................................28
2-13 Voltage and Current Specifications.......................................................................29
2-14 VCC Static and Transient Tolerance .....................................................................32
2-15 AGTL+ Signal Group DC Specifications .................................................................34
2-16 CMOS Signal Group and TAP Signal Group DC Specifications ...................................34
2-17 Open Drain Signal Group DC Specifications...........................................................35
2-18 VCC Overshoot Specifications..............................................................................35
3-1 Package Loading Specifications ...........................................................................41
3-2 Package Handling Guidelines...............................................................................42
3-3 Processor Materials............................................................................................43
4-1 Land Listing by Land Name.................................................................................45
4-2 Land Listing by Land Number..............................................................................55
5-1 Signal Definitions ..............................................................................................65