Datasheet

Dual-Core Intel
®
Xeon
®
Processor 5100 Series Datasheet 35
Electrical Specifications
Notes:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. The V
TT
referred to in these specifications refers to instantaneous V
TT
.
3. Refer to the processor I/O Buffer Models for I/V characteristics.
4. Measured at 0.1*V
TT
.
5. Measured at 0.9*V
TT
.
6. For Vin between 0 V and V
TT
. Measured when the driver is tristated.
Notes:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. Measured at 0.2*V
TT
.
3. V
OH
is determined by value of the external pullup resistor to V
TT
. Refer to platform design guide for details.
4. For V
IN
between 0 V and V
OH
.
2.13.1 V
CC
Overshoot Specification
The Dual-Core Intel
®
Xeon
®
Processor 5100 Series can tolerate short transient
overshoot events where V
CC
exceeds the VID voltage when transitioning from a high-
to-low current load condition. This overshoot cannot exceed VID + V
OS_MAX
(V
OS_MAX
is
the maximum allowable overshoot above VID). These specifications apply to the
processor die voltage as measured across the VCC_DIE_SENSE and VSS_DIE_SENSE
lands and across the VCC_DIE_SENSE2 and VSS_DIE_SENSE2 lands.
V
OH
Output High Voltage 0.9*V
TT
V
TT
V
TT
+0.1 V 2
I
OL
Output Low Current 1.70 N/A 4.70 mA 4
I
OH
Output High Current 1.70 N/A 4.70 mA 5
I
LI
Input Leakage Current N/A N/A ± 100 μA6
Table 2-16. CMOS Signal Group and TAP Signal Group DC Specifications
Symbol Parameter Min Typ Max Units Notes
1
Table 2-17. Open Drain Signal Group DC Specifications
Symbol Parameter Min Typ Max Units Notes
1
V
OL
Output Low Voltage 0 N/A 0.20 V
V
OH
Output High Voltage 0.95 * V
TT
V
TT
1.05 * V
TT
V3
I
OL
Output Low Current 16 N/A 50 mA 2
I
LO
Leakage Current N/A N/A ± 200 μA4
Table 2-18. V
CC
Overshoot Specifications
Symbol Parameter Min Max Units Figure Notes
V
OS_MAX
Magnitude of V
CC
overshoot above VID 50 mV 2-7
T
OS_MAX
Time duration of V
CC
overshoot above VID 25 µs 2-7