Datasheet

Copyright © 2010 Future Technology Devices International Limited 32
Document No.: FT_000052
FT245R USB FIFO IC Datasheet Version 2.12
Clearance No.: FTDI# 39
10.5 Solder Reflow Profile
The FT245R is supplied in Pb free 28 LD SSOP and QFN-32 packages. The recommended solder reflow
profile for both package options is shown in 0.
Figure 10.5 FT245R Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 10.1. Values are shown for
both a completely Pb free solder process (i.e. the FT245R is used with Pb free solder), and for a non-Pb
free solder process (i.e. the FT245R is used with non-Pb free solder).
Profile Feature
Pb Free Solder Process
Non-Pb Free Solder Process
Average Ramp Up Rate (T
s
to T
p
)
3°C / second Max.
3°C / Second Max.
Preheat
- Temperature Min (T
s
Min.)
- Temperature Max (T
s
Max.)
- Time (t
s
Min to t
s
Max)
150°C
200°C
60 to 120 seconds
100°C
150°C
60 to 120 seconds
Time Maintained Above Critical
Temperature T
L
:
- Temperature (T
L
)
- Time (t
L
)
217°C
60 to 150 seconds
183°C
60 to 150 seconds
Peak Temperature (T
p
)
260°C
240°C
Time within 5°C of actual Peak
Temperature (t
p
)
20 to 40 seconds
20 to 40 seconds
Ramp Down Rate
6°C / second Max.
6°C / second Max.
Time for T= 25°C to Peak Temperature,
T
p
8 minutes Max.
6 minutes Max.
Table 10.1 Reflow Profile Parameter Values
Critical Zone: when
T is in the range
T to T
Temperature, T (Degrees C)
Time, t (seconds)
25
P
T = 25º C to T
t
p
T
p
T
L
t
Preheat
S
t
L
Ramp Up
L
p
Ramp
Down
T Max
S
T Min
S