Data Sheet

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prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.

PMMOPA6H

Dat

a Sheet

GlobalTop Technology

Ver. V0

Document #

Other Cautionary Notes on Reflow-Soldering Process:

1. Module must be pre-baked before going through SMT solder reflow process.

2. The usage of solder paste should follow “first in first out” principle. Opened solder paste

needs to be monitored and recorded in a timely fashion (can refer to IPQC for related

documentation and examples).

3. Temperature and humidity must be controlled in SMT production line and storage area.

Temperature of 23°C, 60±5% RH humidity is recommended. (please refer to IPQC for related

documentation and examples)

4. When performing solder paste printing, please notice if the amount of solder paste is in

excess or insufficient, as both conditions may lead to defects such as electrical shortage,

empty solder and etc.

5. Make sure the vacuum mouthpiece is able to bear the weight of the GPS module to prevent

positional shift during the loading process.

6. Before the PCBA is going through the reflow-soldering process, the operators should check

by eyesight to see if there are positional offset to the module.

7. The reflow temperature and its profile data must be measured before the SMT process and

match the levels and guidelines set by IPQC.

8. If SMT protection line is running a double-sided process for PCBA, please process GPS

module during the second pass only to avoid repeated reflow exposures of the GPS module.

Please contact GlobalTop beforehand if you must process GPS module during the 1

pass of

double-side process.

Figure 6.2: Place GPS module right-side up when running reflow-solder process, do not invert.