Data Sheet

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prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2011 GlobalTop Technology Inc. All Rights Reserved.
F
G
PMMOPA6H
Dat
a Sheet
GlobalTop Technology
Ver. V0
A
Document #
Details
Suggestions
Notes
1
Before proceeding with the reflow
-
soldering process, the GPS module must
be pre-baked.
Pre
-
bake Time:
6 Hours @ 60°±5°C or
4 Hours @ 70°±5°C
The maximum tolerated
temperature for the tray is
100°C.
After the pre-baking
process, please make sure
the temperature is
sufficiently cooled down to
35°C or below in order to
prevent any tray
deformation.
2
Because PCBA (along with the patch
antenna) is highly endothermic during
the reflow-soldering process, extra care
must be paid to the GPS module's solder
joint to see if there are any signs of cold
weld(ing) or false welding.
The parameters of the
reflow temperature
must be set accordingly
to module’s reflow-
soldering temperature
profile.
Double check to see if the
surrounding components
around the GPS module are
displaying symptoms of
cold weld(ing) or false
welding.
3
Special attentions are needed for PCBA
board during reflow-soldering to see if
there are any symptoms of bending or
deformation to the PCBA board,
possibility due to the weight of the
module. If so, this will cause concerns at
the latter half of the production process.
A loading carrier fixture
must be used with PCBA
if the reflow soldering
process is using rail
conveyors for the
production.
If there
is any bending or
deformation to the PCBA
board, this might causes
the PCBA to collide into
one another during the
unloading process.
4
Before the PCBA is going through the
reflow-soldering process, the production
operators must check by eyesight to see
if there are positional offset to the
module, because it will be difficult to
readjust after the module has gone
through reflow-soldering process.
The operators must
check by eyesight and
readjust the position
before reflow-soldering
process.
If the operat
or is planning
to readjust the module
position, please do not
touch the patch antenna
while the module is hot in
order to prevent rotational
offset between the patch
antenna and module
Note: References to patch antenna is referred to GPS modules with integrated Patch-on-top
antennas (PA/Gms Module Series), and may not be applicable to all GPS modules.