Data Sheet

3
3
This document is the exclusive property of GlobalTop Tech Inc. and should not be distributed, reproduced, into any other format without
prior permission of GlobalTop Tech Inc. Specifications subject to change without prior notice.
Copyright © 2011 GlobalTop Technology Inc. All Rights Reserved.
F
G
PMMOPA6H
Dat
a Sheet
GlobalTop Technology
Ver. V0
A
Document #
Table of Contents
1. Functional Description ........................................................................................................... 4
1.1 Overview ....................................................................................................................... 4
1.2 Highlights and Features ................................................................................................ 5
1.3 System Block Diagram................................................................................................... 6
1.4 Multi-tone active interference canceller ...................................................................... 7
1.5 1PPS .............................................................................................................................. 7
1.6 AGPS Support for Fast TTFF (EPO™) ............................................................................. 7
1.7 EASY™ ........................................................................................................................... 7
1.8 AlwaysLocate™ (Advance Power Periodic Mode) ......................................................... 9
1.9 Embedded Logger function .......................................................................................... 9
2.0 Antenna Advisor ........................................................................................................... 9
2. Specifications ....................................................................................................................... 10
2.1 Mechanical Dimension ............................................................................................... 10
2.2 Recommended PCB pad Layout .................................................................................. 11
2.3 Pin Configuration ........................................................................................................ 12
2.4 Pin Assignment ........................................................................................................... 13
2.5 Description of I/O Pin ................................................................................................. 14
2.6 Specification List ......................................................................................................... 16
2.7 Absolute Maximum Ratings ........................................................................................ 17
2.8 Operating Conditions .................................................................................................. 17
2.9 GPS External Antenna Specification (Recommended) ............................................... 17
3. Protocols .............................................................................................................................. 18
3.1 NMEA Output Sentences ............................................................................................ 18
3.2 Antenna Status Protocol (Antenna Advisor) ............................................................... 24
3.3 MTK NMEA Command Protocols ................................................................................ 24
3.4 Firmware Customization Services ............................................................................... 25
4. Reference Design .................................................................................................................. 26
4.1 Reference Design Circuit ............................................................................................. 26
5. Packing and Handling ............................................................................................................ 27
5.1 Moisture Sensitivity .................................................................................................... 27
5.2 Packing ........................................................................................................................ 28
5.3 Storage and Floor Life Guideline ................................................................................. 30
5.4 Drying .......................................................................................................................... 30
5.5 ESD Handling ............................................................................................................... 31
6. Reflow Soldering Temperature Profile ................................................................................... 32
6.1 SMT Reflow Soldering Temperature Profile ................................................................ 32
6.2 Manual Soldering ........................................................................................................ 36
7. Contact Information .............................................................................................................. 37