Microcontrollers Data Sheet

Advance Information MC68HC(7)08KH12 — Rev. 1.1
260 Freescale Semiconductor
18.3 Plastic Quad Flat Pack (QFP)
Figure 18-1. 64-Pin Quad-Flat-Pack (Case 840C-04)
GH
E
C
DETAIL A
L
A
48
S
L
–D–
–A–
–B–
0.05 (0.002) A–B
S
A–B
M
0.20 (0.008) D
S
H
S
A–B
M
0.20 (0.008) D
S
C
B
V
0.05 (0.002) D
S
A–B
M
0.20 (0.008) D
S
H
S
A–B
M
0.20 (0.008) D
S
C
SEATING PLANE
DATUM PLANE
–C–
–H–
49
33
32
64
17
1
16
DETAIL C
0.10 (0.004)
S
A–B
M
0.20 (0.008) D
S
C
SECTION B–B
F
N
D
BASE
J
METAL
DETAIL A
P
BB
–A–, –B–, –D–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS A–B AND –D– TO BE DETERMINED AT
DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED 0.53
(0.021). DAMBAR CANNOT BE LOCATED ON THE
LOWER RADIUS OR THE FOOT.
8. DIMENSION K IS TO BE MEASURED FROM THE
THEORETICAL INTERSECTION OF LEAD FOOT
AND LEG CENTERLINES.
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 13.90 14.10 0.547 0.555
B 13.90 14.10 0.547 0.555
C 2.07 2.46 0.081 0.097
D 0.30 0.45 0.012 0.018
E 2.00 0.079
F 0.30 0.012
G 0.80 BSC 0.031 BSC
—
H 0.067 0.250 0.003 0.010
J 0.130 0.230 0.005 0.090
K
L 12.00 REF 0.472 REF
M
N 0.130 0.170 0.005 0.007
P 0.40 BSC 0.016 BSC
Q
R 0.13 0.30 0.005 0.012
S 16.20 16.60 0.638 0.654
T 0.20 REF 0.008 REF
U
V 16.20 16.60 0.638 0.654
X 1.10 1.30 0.043 0.051
2.40 0.094
—
DETAIL C
SEATING PLANE
M
U
T
R
Q
K
X
M
5° 5°10° 10°
2° 2°8° 8°
0° 0°——
0.660 0.020 0.0260.500