F89FTSM13
FN-LINK TECHNOLOGY LIMITED CONTENTS 0 REVESION HISTORY............................................................................................................................................... 3 1 INTRODUCTIONS......................................................................................................................................................4 2 3 4 5 1.1 OVERVEIW...................................................................................................................
FN-LINK TECHNOLOGY LIMITED 0. Revision History REV NO Date Rev.1.0 2015-7-9 http://www.fn-link.
FN-LINK TECHNOLOGY LIMITED 1. Introduction 1.1 Overview F89FTSM13 is a highly integrated and excellent performance Wireless LAN (WLAN) SDIO network interface device. High-speed wireless connection up to 150 Mbps. The general hardware for the module is shown in Figure 1. This WLAN Module design is based on Realtek RTL8189FTV. It is a highly integrated single-chip 1*1 MIMO (Multiple In Multiple Out) Wireless LAN (WLAN) SDIO network interface controller complying with the 802.11n specification.
FN-LINK TECHNOLOGY LIMITED 2. GENERAL SPECIFICATION 2.1 WiFi RF Specifications Main Chipset RTL8189FTV Operating Frequency 2.400～2.4835GHz Standards WiFi: IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, Modulation WiFi: 802.11b: CCK(11, 5.5Mbps), QPSK(2Mbps), BPSK(1Mbps), 802.11 g/n: OFDM PHY Data rates WiFi: 802.11b: 11,5.5,2,1 Mbps 802.11g: 54,48,36,24,18,12,9,6 Mbps 802.11n: up to 150Mbps Transmit Output Power WiFi: 802.11b <16dBm 802.11g <14dBm 802.
FN-LINK TECHNOLOGY LIMITED 3. Mechanical Specification 3.1 Outline Drawing 3.2 PCB LAYOUT (Unit: ±0.15mm) http://www.fn-link.
FN-LINK TECHNOLOGY LIMITED 3.3 PIN Assignment Pin # Name Description 1 GND GND 2 RF RF OUTPUT 3 GND GND 4~8 NC NC 9 VBAT 3.3V Optional 10 NC NC 11 NC NC 12 WL_REG_ON WL_REG_ON 13 WL_HOST_WAKE WAKE UP 14 SDIO_DATA_2 SDIO_D2 15 SDIO_DATA_3 SDIO_D3 16 SDIO_DATA_CMD SDIO_CMD 17 SDIO_DATA_CLK SDIO_CLK 18 SDIO_DATA_D0 SDIO_D0 19 SDIO_DATA_D1 SDIO_D1 20 GND GND 21 NC NC 22 VDIO 1.8~3.
FN-LINK TECHNOLOGY LIMITED 32 NC NC 33 GND GND 34~35 NC NC 36 GND GND 37~40 NC NC 41 GND GND 42~44 NC NC 3.4 Application Circuit http://www.fn-link.
FN-LINK TECHNOLOGY LIMITED 4. Environmental Requirements 4.1 Operating & storage tempreture Operating Storage MTBF (Mean Time Between Failures) Temperature: -5°C to +55°C Relative Humidity: 10-90% (non-condensing) Temperature: -40°C to +80°C (non-operating) Relative Humidity: 5-90% (non-condensing) Over 150,000hours 4.2 Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature : <250°C Number of Times : ≤2 times 4.
FN-LINK TECHNOLOGY LIMITED 3. Once opened, such as when not used up within 168 hours: 1). The module must be again to remove the module moisture absorption. 2). The baking temperature: 125 ℃, 8 hours. 3.) After baking, put the right amount of desiccant to seal packages. 5. PACKING INFORMATION 5.1 Blister packaging A piece of 100 PCS 5.2 Coiling Packaging A roll of 2000pcs http://www.fn-link.
FN-LINK TECHNOLOGY LIMITED 1 The module will be responsible to satisfy SAR/RF Exposure requirements, when the module integrated into any (portable, mobile, fixed) host device. 2AATL-F89FTSM13 http://www.fn-link.
FN-LINK TECHNOLOGY LIMITED This devic has been evaluated and shown compliant with the FCC RF Exposure limits under fixed exposure conditions (antennas are greater than 20cm from a person's body) when installed in certain specific OEM configurations. FCC Radiation Exposure Statement: This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Attention: Limited Modular Approval ‐ this RF Module may not be sold to the generic public and requires professional installation. Due to the fact that this RF Module is not equipped with an own shielding, the end‐product incl. this RF Module has to show compliance to the FCC rules (15C / radiated emissions). (OEM) Integrator has to assure compliance of the entire end‐product incl. the integrated RF Module. Additional measurements (15C) and/or equipment authorizations (e.
