User Manual

FN-LINK TECHNOLOGY LIMITED
http://www.fn-link.com
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1. Introduction
1.1 Over view
F23BDSM23-W2 is a small size and low profile of WiFi + BT Combo module with LGA (Land-Grid Array)
footprint, board size is 12mm*12mm with module thickness of 2mm. It can be easily manufactured on
SMT process and highly suitable for tablet PC, ultra book, mobile device and consumer products. It
provides SDIO interface for WiFi to connect with host processor and high speed UART interface for BT.
It also has a PCM interface for audio data transmission with direct link to external audio codec via BT
controller. The WiFi throughput can go up to 150Mbps in theory by using 1x1 802.11n b/g/n MIMO
technology and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.0.
F23BDSM23-W2 uses Realtek RTL8723BS, a highly integrated WiFi/BT single chip based on
advanced COMS process. RTL8723BS integrates whole WiFi/BT function blocks into a chip, such as
SDIO/UART, MAC, BB, AFE, RFE, PA, EEPROM and LDO/SWR, except fewer passive components
remained on PCB. The general block diagram for the module is shown in Figure 1
Figure 1
1.2 Product Features
 Operate at ISM frequency bands (2.4GHz)
 SDIO for WiFi and UART for Bluetooth
 IEEE standards support: IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11d, IEEE
802.11e, IEEE 802.11h, IEEE 802.11i
 Fully Qualified for Bluetooth 2.1+EDR specification including both 2Mbps and 3Mbps modulation
mode
 Fully qualified for Bluetooth 3.0
 Fully qualified for Bluetooth 4.0 Dual mode
 Full–speed Bluetooth operation with Piconet and Scatternet support
 Enterprise level security which can apply WPA/WPA2 certification for WiFi.
 WiFi 1 transmitter and 1 receiver allow data rates supporting up to 150 Mbps downstream and 150
Mbps upstream PHY rates
Note: The EUT does not support the technology MIMO .