Data Sheet

FMB110 Datasheet Ver.1.0
-20-
guidance on solder re-flow.
There are four zones:
Preheat Zone - This zone raises the temperature at a controlled rate, typically 1-2.5°C/s.
Equilibrium Zone - This zone brings the board to a uniform temperature and also activates the flux. The
duration in this zone (typically 2-3 minutes) will need to be adjusted to optimise the out gassing of the flux.
Reflow Zone- The peak temperature should be high enough to achieve good wetting but not so high as to
cause component discoloration or damage. Excessive soldering time can lead to intermetallic growth which
can result in a brittle joint.
Cooling Zone - The cooling rate should be fast, to keep the solder grains small which will give a longer
lasting joint. Typical rates will be 2-5°C/s.
Figure 6: Typical Lead-Free Re-flow Solder Profile for FMB110
Key features of the profile:
■ Initial Ramp = 1-2.5°C/sec to 175°C ±25°C equilibrium
■ Equilibrium time = 60 to 180 seconds
■ Ramp to Maximum temperature (250°C) = 3°C/sec max.
■ Time above liquidus temperature (217°C): 45-90 seconds
■ Device absolute maximum reflow temperature: 255°C
Note: Customer might choose a local 0.2mm thickness solder cream for the module, or use 0.15mm to
match other components in the same PCB.