User's Manual
Table Of Contents
- 1 Disclaimers
- 2 Safety information
- 3 Notice to user
- 4 Customer help
- 5 Quick Start Guide
- 6 Description
- 7 Operation
- 7.1 Charging the battery
- 7.2 Turning on and turning off the camera
- 7.3 Saving an image
- 7.4 Recalling an image
- 7.5 Deleting an image
- 7.6 Deleting all images
- 7.7 Measuring a temperature using a spotmeter
- 7.8 Hiding measurement tools
- 7.9 Changing the color palette
- 7.10 Changing the image mode
- 7.11 Changing the temperature scale mode
- 7.12 Setting the emissivity
- 7.13 Changing the reflected apparent temperature
- 7.14 Changing the distance
- 7.15 Performing a non-uniformity correction
- 7.16 Using the camera lamp
- 7.17 Configuring Wi-Fi
- 7.18 Changing the settings
- 7.19 Updating the camera
- 8 Technical data
- 9 Mechanical drawings
- 10 CE Declaration of conformity
- 11 Cleaning the camera
- 12 Application examples
- 13 About FLIR Systems
- 14 Definitions and laws
- 15 Thermographic measurement techniques
- 16 History of infrared technology
- 17 Theory of thermography
- 18 The measurement formula
- 19 Emissivity tables
Emissivity tables19
Table 19.1 T: Total spectrum; SW: 2–5 µm; LW: 8–14 µm, LLW: 6.5–20 µm; 1: Material; 2: Specification;
3:Temperature in °C; 4: Spectrum; 5: Emissivity: 6:Reference (continued)
1 2 3 4 5 6
Carbon graphite, filed
surface
20 T 0.98 2
Carbon
lampblack 20–400 T 0.95–0.97 1
Chipboard untreated 20 SW
0.90 6
Chromium polished 50 T 0.10 1
Chromium
polished 500–1000 T 0.28–0.38 1
Clay fired
70 T 0.91 1
Cloth
black 20 T 0.98 1
Concrete
20 T 0.92 2
Concrete dry 36 SW
0.95 7
Concrete
rough 17
SW
0.97 5
Concrete
walkway
5
LLW 0.974 8
Copper commercial,
burnished
20 T 0.07 1
Copper
electrolytic, care-
fully polished
80 T 0.018 1
Copper electrolytic,
polished
–34 T 0.006 4
Copper
molten 1100–1300 T 0.13–0.15 1
Copper
oxidized 50 T 0.6–0.7 1
Copper
oxidized to
blackness
T 0.88 1
Copper oxidized, black 27 T 0.78 4
Copper oxidized, heavily 20 T 0.78 2
Copper polished 50–100 T 0.02 1
Copper polished 100 T 0.03 2
Copper polished,
commercial
27 T 0.03 4
Copper
polished,
mechanical
22 T 0.015 4
Copper pure, carefully
prepared surface
22 T 0.008 4
Copper
scraped 27 T 0.07 4
Copper dioxide
powder T 0.84 1
Copper oxide
red, powder T 0.70 1
Ebonite T 0.89 1
Emery
coarse 80 T 0.85 1
Enamel 20 T 0.9 1
Enamel lacquer 20 T 0.85–0.95 1
Fiber board hard, untreated 20
SW
0.85 6
Fiber board masonite 70
SW
0.75 9
Fiber board masonite 70 LW 0.88 9
Fiber board particle board 70
SW
0.77 9
Fiber board particle board 70 LW 0.89 9
Fiber board porous, untreated 20
SW
0.85 6
#T559918; r. AL/40424/40424; en-US
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