Data Sheet
Table Of Contents
- 1Introduction
- 2General Specification
- 3Pin Configuration
- 4Pin Definition
- 5Device Details
- 6Bluetooth Subsystem
- 7System Power States
- 8Host Interfaces Subsystem
- 9Applications Subsystem
- 10Audio Subsystem
- 11Audio Subsystem
- 12Peripheral Interfaces
- 13System Manager
- 14PMU Subsystem
- 15Bluetooth Performance Specification
- 16Reference Design
- 17Recommended Reflow Profile
- 18 Mechanical Characteristic
- 19 Recommended PCB Layout and Mounting Pattern
- 20 Ordering Information
- 21 Cautions &Warnings
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FLC-BTM901 Datasheet
Flaircomm Microelectronics,Inc. - 48-
19 Recommended PCB Layout and Mounting Pattern
A very important factor in achieving maximum Bluetooth performance is the placement of
a module with on-board antenna designs onto the carrier board and corresponding PCB
layout. There should be no any trace, ground and vias in the area of the carrier board
underneath the module’s on-board antenna section as indicated in Figure 4. Antenna
portion of the module must be placed at least 15mm away from any metal part and the
antenna should not be covered by any piece of metal. The antenna of the module MUST
be kept as far from potential noise sources as possible and special care must also be
taken with placing the module in proximity to circuitry that can emit heat. The RF part of
the module is very sensitive to temperature and sudden changes can have an adverse
impact on performance.
Figure 7：Leave 15mm Clearance Space from the Module Built-in Antenna