User's Manual

FLC-BTM805 Datasheet
Flaircomm Microelectronics Confidential
-34-
 Distance between connection and ground area on the top layer should at least be as large as the
dielectric thickness.
 Routing the RF close to digital sections of the system board should be avoided.
 To reduce signal reflections, sharp angles in the routing of the micro strip line should be avoided.
Chamfers or fillets are preferred for rectangular routing; 45-degree routing is preferred over
Manhattan style 90-degree routing.
Figure 24: Recommended Trace Connects Antenna and the Module
 Routing of the RF-connection underneath the module should be avoided. The distance of the
micro strip line to the ground plane on the bottom side of the receiver is very small and has huge
tolerances. Therefore, the impedance of this part of the trace cannot be controlled.
 Use as many vias as possible to connect the ground planes.