Datasheet

1. Structure and Configuration of the TGS #813
Resin moulding
FIG.l. TGS #813 CONFIGURATION.
l(4) 3(6)
26)
5(2)
@
4(l) 601
FIG.2. TGS #813 DIAGRAM OF THE
CIRCUIT.
l Remarks:
Pins numbered 1 and 3
connected internally.
Pins numbered 4 and 6
connected internally.
ELECTRIC
are
are
Figs.l & 3 show the structure and configuration
of the TGS ß813 Sensor.
Dimensions in millrmeter
FIG.3. TGS #813 STRUCTURAL
SPECIFICATIONS.
The TGS #813 is a sintered bulk semiconductor composed mainly of tio dioxide
(Sn&) l
The semiconductor material and electrodes are deposited on a ceramic
tubular former.
The heater coil is located inside the ceramic former. This coil, made of 60
micron diameter wire, has a resistance of 30R.
The lead wires from the Sensor electrodes are a gold alloy of 80 micron diameter.
The heater and lead wires are spotwelded to the Sensor pins which are arranged
to fit a 7 pin miniature tube
socket.
The pins tan withstand a withdrawal
forte in excess of 5Kg.
The Sensor base and cover are made of nylon 66 conforming to UL 94HB Authorized
Material Standard. The deformation temperature for this material is in excess
of 240°C.
The upper and lower openings in the Sensor case are covered with a flameproof
double layer of 100 mesh stainless steel gauze conforming to SUS 316.
Inde-
pendent tests tonfirm that this mesh will prevent a spark produced inside the
flameproof cover from igniting an explosive 2
: 1 mixture of hydrogen/oxygen.
The type 8813 Sensor meets the mechanical requirements listed in Table 1.
(2)