FSC-BW236 Datasheet Bluetooth and Wi-Fi combo module Version 1.5 Shenzhen Feasycom Technology Co.,Ltd -1- www.feasycom.
FSC-BW236 Datasheet Copyright © 2013-2020 Feasycom Technology. All Rights Reserved. Feasycom Technology reserves the right to make corrections, modifications, and other changes to its products, documentation and services at anytime. Customers should obtain the newest relevant information before placing orders. To minimize customer product risks, customers should provide adequate design and operating safeguards.
FSC-BW236 Datasheet Contents 1. INTRODUCTION ............................................................................................................................................................... 4 2. HARDWARE SPECIFICATION .......................................................................................................................................... 5 2.1 BLOCK DIAGRAM AND PIN DIAGRAM ..................................................................................................
FSC-BW236 Datasheet 1. INTRODUCTION Overview Application FSC-BW236 is a highly integrated single-chip low power Wireless POS dual bands (2.4GHz and 5GHz) Wireless LAN (WLAN) and Measurement and monitoring systems Bluetooth Low Energy (v5.0) communication controller.
FSC-BW236 Datasheet 2. HARDWARE SPECIFICATION 2.1 Block Diagram and PIN Diagram UART Internal(Defau lt) or external antenna IPEX External Antenna (optional) (optional) J-Link/Debug Filter PIOs Wake up/ EXT_32K AIOs 40MHZ Crystal Single-Chip BT&WLAN Soc (ARM Cortex M4F And Cortex M0) SPI/USB Reset/Chip EN I2C VDD SPI Flash(Default) or external SPI Flash External SPI Flash (optional) Figure 2: Block Diagram Figure 3: FSC-BW236 PIN Diagram(Top View) 2.
FSC-BW236 Datasheet Alternative Function 1: Programmable input/output line Alternative Function 2: USB_DP 8 SPI_MOSI/USB_DN SPI_MOSI Alternative Function 1: Programmable input/output line Alternative Function 2: USB_DN 9 UART_LOG_OUT O Debug Interface (Data OUT) 10 UART_ LOG_IN I Debug Interface (Data IN) 11 RESET/CHIP_EN I External reset input: Active LOW, Set this pin low reset the module. (With Internal pull-up 100K resistor.) 12 VDD_3V3 Vdd Power supply voltage 3.
FSC-BW236 Datasheet Note 3 Note 4 Note 5 It is essential to remember that pull-up resistors on both SCL and SDA lines are not provided in the module and MUST be provided external to the module. BT LED(Default) /Status – LED Power On: Light Slow Shinning ; Connected: Steady Lighting. Status Disconnected: Low Level; Connected: High Level WIFI LED(Default) /Status -- LED Power On: Light Slow Shinning ; Connected: Steady Lighting. Status Disconnected: Low Level; Connected: High Level.
FSC-BW236 Datasheet Bluetooth basic parameter： 2402–2480 MHz Bluetooth 5.0 Mode (BLE); 1 Mbps over the air data rate. TX output power of +8dBm. Receiver to achieve maximum sensitivity -85dBm @ 1 Mbps BLE. 3.5 Serial Interfaces 3.5.1 UART Support 1 HS-UART UART(RS232 Standard) Serial Data Format Transmit and Receive data FIFO Programmable asynchronous clock support Auto flow control Programmable Receive data FIFO trigger level UART signal level ranges 3.
FSC-BW236 Datasheet corruption if two or more masters attempt to control the bus simultaneously. Data is transferred between a Master and a Slave synchronously to SCL on the SDA line on a byte-by-byte basis. Each data byte is 8-bit long. There is one SCL clock pulse for each data bit with the MSB being transmitted first. An acknowledge bit follows each transferred byte.
FSC-BW236 Datasheet Support DMA interface for DMA transfer Independent masking of interrupts FIFO depth – The transmit and receive FIFO buffers 64 words deep. The FIFO width is fixed at 16 bits. Hardware/software slave-select – Dedicated hardware slave-select lines can be used or software control can be used to target the serial-slave device Programmable features: --Clock bit-rate – Dynamic control of the serial bit rate of the data transfer; used in only serial- master mode of operation.
FSC-BW236 Datasheet TST - Storage Temperature -55 +125 °C TJT - Junction Temperature 0 +125 °C IIO - Maximum Current sunk by a I/O pin 4 mA IIO - Maximum Current sourced by a I/O pin 4 mA 4.2 Recommended Operating Conditions Table 5: Recommended Operating Conditions Parameter Min Type Max Unit 3 3.3 3.6 V Vss-0.3 3.3 Vdd+0.
FSC-BW236 Datasheet 4.4 Power State and Power Sequence Table 7: Timing specification of power sequence Parameter Max Unit 0.6 1 ms 1 - - ms Tcore - LP core power ready time 1.5 1.5 - ms Tboot - 200 200 - ms 0 0 0.5 * VDDx V 1 1 - ms TPRDY - VDDx ready time Tclk - Internal ring clock stable time after VDD1833 ready Vrst Trst - HS MCU boot time Shutdown occurs after CHIP_EN lower than this voltage The required time that CHIP_EN lower than VRST Min Type 0.
FSC-BW236 Datasheet 4.6 Shutdown Sequence Note: VDDx is the supply power of VDD_3V3 Figure 7: Timing sequence of shutdown 4.7 I2C Dynamic Characteristics Table 8: I2C Dynamic Characteristics Parameter tLOW - SCL low period THIGH - SCL high period Standard Mode[1][2] Min Max Fast Mode[1][2] Min Max Unit 4.7 - 1.2 - uS 4 - 0.6 - uS 4.7 - 1.2 - uS tSU; STA time Repeated START condition setup tHD; STA - START condition hold time 4 - 0.
FSC-BW236 Datasheet Note: 1. Guaranteed by design, not tested in production. 2. HCLK must be higher than 2 MHz to achieve the maximum standard mode I2C frequency. It must be higher than 8 MHz to achieve the maximum fast mode I2C frequency. 3. I2C controller must be retriggered immediately at slave mode after receiving STOP condition. 4. The device must internally provide a hold time of at least 300 ns for the SDA signal in order to bridge the undefined region of the falling edge of SCL. 5.
FSC-BW236 Datasheet 5. RECOMMENDED TEMPERATURE REFLOW PROFILE Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New packages contain desiccate (to absorb moisture) and a humidity indicator card to display the level maintained during storage and shipment. If directed to bake units on the card, please check the below and follow instructions specified by IPC/JEDEC J-STD-033. Note: The shipping tray cannot be heated above 65°C.
FSC-BW236 Datasheet discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. The recommended peak temperature (Tp) is 230 ~ 250 C. The soldering time should be 30 to 90 second when the temperature is above 217 C. Cooling Zone (E) — The cooling ate should be fast, to keep the solder grains small which will give a longer-lasting joint. Typical cooling rate should be 4 C. MECHANICAL DETAILS 7. 7.
FSC-BW236 Datasheet 8.2 Layout Guidelines(Internal Antenna) It is strongly recommended to use good layout practices to ensure proper operation of the module. Placing copper or any metal near antenna deteriorates its operation by having effect on the matching properties. Metal shield around the antenna will prevent the radiation and thus metal case should not be used with the module.
FSC-BW236 Datasheet Antenna Antenna Non enmitting circuits Non enmitting circuits RF & heat enmitting circuits RF_IN Digital Part RF & heat enmitting circuits Digital Part RF_IN Digital & Analog Circuits Digital & Analog Circuits PCB PCB Figure 12: Placement the Module on a System Board Antenna 5mm Matching Network RF_IN Figure 13: Leave 5mm Clearance Space from the Antenna General design recommendations are: The length of the trace or connection line should be kept as short as possible.
FSC-BW236 Datasheet Warning: Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. FCC Statement:This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
FSC-BW236 Datasheet OEM Statement a. The module manufacturer must show how compliance can be demonstrated only for specific host or hosts b. The module manufacturer must limit the applicable operating conditions in which transmitter will be used, and c. The module manufacturer must disclose that only the module grantee can make the evaluation that the module is compliant in the host.
FSC-BW236 Datasheet 996369 D02 FAQ – Modules for Micro-Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements. a) Information that includes permitted variances (e.g.
FSC-BW236 Datasheet host manufacturer’s determination that a module as installed in a host complies with FCC requirements. Explanation: Data transfer module demo board can control the EUT work in RF test mode at specified test channel. 2.10 Additional testing, Part 15 Subpart B disclaimer The grantee should include a statement that the modular transmitter is only FCC authorized for the specific rule parts (i.e.
