Datasheet

www.fairchildsemi.com 6 OF 8 11/01/01 DS300222
0.070 (1.78)
0.060 (1.52)
0.030 (0.76)
0.100 (2.54)
0.305 (7.75)
0.425 (10.79)
Recommended Pad Layout for
Surface Mount Leadform
Package Dimensions (Surface Mount)
0.350 (8.89)
0.320 (8.13)
0.260 (6.60)
0.240 (6.10)
0.390 (9.90)
0.332 (8.43)
0.070 (1.77)
0.040 (1.02)
0.014 (0.36)
0.010 (0.25)
0.320 (8.13)
0.035 (0.88)
0.006 (0.16)
0.012 (0.30)
0.008 (0.20)
0.200 (5.08)
0.115 (2.93)
0.025 (0.63)
0.020 (0.51)
0.020 (0.50)
0.016 (0.41)
0.100 [2.54]
Package Dimensions (Through Hole)
0.350 (8.89)
0.320 (8.13)
0.260 (6.60)
0.240 (6.10)
0.320 (8.13)
0.070 (1.77)
0.040 (1.02)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41)
0.100 (2.54)
15°
0.012 (0.30)
Package Dimensions (0.4”Lead Spacing)
0.350 (8.89)
0.320 (8.13)
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.020 (0.50)
0.016 (0.41)
0.100 [2.54]
0.100 (2.54)
0.015 (0.38)
0.012 (0.30)
0.008 (0.21)
0.425 (10.80)
0.400 (10.16)
NOTE
All dimensions are in inches (millimeters)
6-PIN DIP
OPTOISOLATORS LOGIC OUTPUT
H11L1M H11L2M H11L3M