Datasheet

©2003 Fairchild Semiconductor Corporation Rev. B1, September 2003
2N5086/2N5087/MMBT5087
Thermal Characteristics T
a
=25°C unless otherwise noted
* Device mounted on FR-4 PCB 1.6” × 1.6” × 0.06."
Symbol Parameter
Max.
Units
2N5086
2N5087
*MMBT5087
P
D
Total Device Dissipation
Derate above 25°C
625
5.0
350
2.8
mW
mW/°C
R
θJC
Thermal Resistance, Junction to Case 83.3 °C/W
R
θJA
Thermal Resistance, Junction to Ambient 200 357 °C/W