Datasheet

MM74HCT14 • Rev. 1.4.2 9

MM74HCT14 — Hex Inverting Schmitt Trigger

Physical Dimensions

C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,

AND TIE BAR EXTRUSIONS

F. DRAWING FILE NAME: MTC14REV6

R0.09 min

12.00°

TOP & BOTTOM

0.43 TYP

1.00

D. DIMENSIONING AND TOLERANCES PER ANSI

Y14.5M, 1982

R0.09min

E. LANDPATTERN STANDARD: SOP65P640X110-14M

0.65

6.10

1.65

0.45

A. CONFORMS TO JEDEC REGISTRATION MO-153,

VARIATION AB, REF NOTE 6

B. DIMENSIONS ARE IN MILLIMETERS

Figure 7. 14-Lead, Thin-Shrink Small-Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

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without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify

or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically

the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/