Datasheet

FSBB30CH60F Motion SPM® 3 Series
©2006 Fairchild Semiconductor Corporation 11 www.fairchildsemi.com
FSBB30CH60F Rev. C6
Figure 9. Recommended MCU I/O Interface Circuit
3rd Notes:
1. RC coupling at each input (parts shown dotted) might change depending on the PWM control scheme in the application and the wiring impedance of the application’s printed
circuit board. The Motion SPM
®
3 Product input signal section integrates a 3.3 k(typ.) pull-down resistor. Therefore, when using an external filtering resistor, pay attention to
the signal voltage drop at input terminal.
2. The logic input works with standard CMOS or LSTTL outputs.
Figure 10. Recommended Bootstrap Operation Circuit and Parameters
3rd Notes:
3. It would be recommended that the bootstrap diode, D
BS
, has soft and fast recovery characteristics.
4. The bootstrap resistor (R
BS
) should be three times greater than R
E(H)
. The recommended value of R
E(H)
is 5.6 , but it can be increased up to 20 (maximum) for a slower dv/
dt of high-side.
5. The ceramic capacitor placed between V
CC
- COM should be over 1 F and mounted as close to the pins of the Motion SPM 3 product as possible.
MCU
SPM
COM
+5 V
1 nF
4.7 k
,,
IN
(UL)
IN
(VL)
IN
(WL)
,,
IN
(UH)
IN
(VH)
IN
(WH)
V
FO
100 
1 nF
R
PF
=
C
PF
=
+15 V
22 µF
0.1 µF
1000 µF1 µF
One-Leg Diagram of
Motion SPM 3 Product
Vcc
IN
COM
VB
HO
VS
Vcc
IN
COM
OUT
Inverter
Output
P
N
These values depend on PWM control algorithm.
D
BS
R
BS
R
E(H)
V
SL