Datasheet

© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
FSA8049 • Rev. 1.0.2 7
FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch
Physical Dimensions
Figure 6. 9-Ball, Wafer-Level Chip-Scale Package (WLCSP), 3x3 Array, 0.4 mm Pitch, 250 µm Ball
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Ordering Information
Part
Number
Operating
Temperature
Range
Top
Mark
Package D E X Y
FSA8049UCX -40 to +85°C M3
9-Ball, Wafer-Level Chip-Scale Package
(WLCSP), 3x3 Array, 0.4 mm Pitch,
250 µm Ball
1.16 mm 1.16 mm 0.018 mm 0.018 mm
0.03
C
2X
B
A
0.03
C
2X
0.208±0.021
0.378±0.018
D
C
0.06
C
0.05
C
PIN A1
INDEX AREA
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASMEY14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC009ABrev2
F
F
E
E
D
A1
Ø0.20
Cu Pad
Ø0.30
Solder Mask
0.40
0.40
SIDE VIEWS
Ø0.260±0.020
9X
0.40
0.40
(X)±0.018
(Y)±0.018
A
B
C
123
BOTTOM VIEW
TOP VIEW
0.625
0.547
SEATING PLANE
LAND PATTERN RECOMMENDATION
(NSMD PAD TYPE)