Datasheet
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF3003 • Rev. 1.0.0 16
FPF3003 — IntelliMAX™ Full Functional In
p
ut Power Path Mana
g
ement Switch for Dual-Batter
y
Portable S
y
stems
Packaging Information
Figure 38. 1.6mmx1.6mm WLCSP, 16-Bumps 0.4mm Pitch
Product-Specific Dimensions
Product D E X Y
FPF3003UCX 1560m ±30m 1560m ±30m 180m 180m
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
.
BOTTOM VIEW
SIDE VIEWS
TOP VIEW
RECOMMENDED LAND PATTERN
BALL A1
INDEX AREA
1
2
3
4
A
B
C
D
SEATING
PLANE
16X
A1
0.005 CAB
F
(NSMD PAD TYPE)
Ø0.260±0.02
0.40
0.40
(X) ±0.018
(Y) ±0.018
0.625
0.547
0.06 C
0.05
C
E
D
F
0.378±0.018
0.208±0.021
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASME Y14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC016AArev2.
0.03
C
2X
0.03 C
2X
E
D
B
C
A
0.40
0.40
(Ø0.20)
Cu Pad
(Ø0.30) Solder
Mask Opening