Datasheet

FFB2907A / FMB2907A / MMPQ2907A — PNP Multi-Chip General-Purpose Amplifier
© 1998 Fairchild Semiconductor Corporation www.fairchildsemi.com
FFB2907A / FMB2907A / MMPQ2907A Rev. 1.1.0 2
Ordering Information
Absolute Maximum Ratings
(1),(2)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. Values are at T
A
= 25°C unless otherwise noted.
Notes:
1. These ratings are based on a maximum junction temperature of 150°C.
2. These are steady-state limits. Fairchild Semiconductor should be consulted on applications involving pulsed or
low-duty cycle operations.
Thermal Characteristics
(3)
Values are at T
A
= 25°C unless otherwise noted.
Note:
3. PCB size: FR-4 76 x 114 x 1.57 mm
3
(3.0 inch x 4.5 inch x 0.062 inch) with minimum land pattern size.
Part Number Top Mark Package Packing Method
FFB2907A .2F SC70 6L Tape and Reel
FMB2907A .2F SSOT 6L Tape and Reel
MMPQ2907A MMPQ2907A SOIC 16L Tape and Reel
Symbol Parameter Value Unit
V
CEO
Collector-Emitter Voltage -60 V
V
CBO
Collector-Base Voltage -60 V
V
EBO
Emitter-Base Voltage -5.0 V
I
C
Collector Current - Continuous -600 mA
T
J
, T
STG
Junction and Storage Temperature -55 to +150 °C
Symbol Parameter
Max.
Unit
FFB2907A FMB2907A MMPQ2907A
P
D
Total Device Dissipation 300 700 1,000 mW
Derate Above 25°C2.45.68.0mW/°C
R
θJA
Thermal Resistance, Junction to Ambient 415 180
°C/W
Thermal Resistance, Junction to Ambient,
Effective 4 Die
125
Thermal Resistance, Junction to Ambient,
Each Die
240