Datasheet

FDS9934C Rev D(W)
Electrical Characteristics (continued) T
A
= 25°C unless otherwise noted
Symbol Parameter Test Conditions Type Min Typ Max Units
Switching Characteristics (Note 2)
t
d(on)
Turn-On Delay Time Q1
Q2
8
16
16
29
ns
t
r
Turn-On Rise Time Q1
Q2
9
9
17
18
ns
t
d(off)
Turn-Off Delay Time Q1
Q2
15
25
26
41
ns
t
f
Turn-Off Fall Time
Q1
V
DD
= 10 V, I
D
= 1 A,
V
GS
= 4.5V, R
GEN
= 6Ω
Q2
V
DD
= –6V, I
D
= –1A,
V
GS
= –4.5V, R
GEN
= 6Ω
Q1
Q2
4
9
9
19
ns
Q
g
Total Gate Charge Q1
Q2
6.2
8.7
9
12
nC
Q
gs
Gate-Source Charge Q1
Q2
1.2
2.1
nC
Q
gd
Gate-Drain Charge
Q1
V
DS
= 10 V, I
D
= 3 A, V
GS
= 4.5V
Q2
V
DS
= –6 V, I
D
= –3.2 A,V
GS
= –4.5 V
Q1
Q2
1.7
2.1
nC
Drain–Source Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous Drain-Source Diode Forward Current Q1
Q2
1.3
–1.3
A
V
SD
Drain-Source Diode Forward
Voltage
V
GS
= 0 V, I
S
= 1.3 A (Note 2)
V
GS
= 0 V, I
S
= -2.0 A (Note 2)
Q1
Q2
0.73
–0.8
1.2
–1.2
V
t
rr
Diode Reverse Recovery
Time
Q1
Q2
15
20
nS
Q
rr
Diode Reverse Recovery
Charge
Q1
I
F
= 6.5 A, d
iF
/d
t
= 100 A/µs
Q2
I
F
= -3.2 A, d
iF
/d
t
= 100 A/µs
Q1
Q2
5
7
nC
Notes:
1. R
θJA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R
θJC
is guaranteed by design while R
θCA
is determined by the user's board design.
a) 78°C/W when
mounted on a
0.5 in
2
pad of 2 oz
copper
b) 125°C/W when
mounted on a .02 in
2
pad of 2 oz copper
c) 135°C/W when mounted on a
minimum pad.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
FDS9934C