Datasheet
FDMS8570SDC N-Channel PowerTrench
®
SyncFET
TM
©2012 Fairchild Semiconductor Corporation
FDMS8570SDC Rev.C2
www.fairchildsemi.com
3
Thermal Characteristics
R
θJC
Thermal Resistance, Junction to Case (Top Source) 4.4
°C/W
R
θJC
Thermal Resistance, Junction to Case (Bottom Drain) 2.1
R
θJA
Thermal Resistance, Junction to Ambient (Note 1a) 38
R
θJA
Thermal Resistance, Junction to Ambient (Note 1b) 81
R
θJA
Thermal Resistance, Junction to Ambient (Note 1c) 27
R
θJA
Thermal Resistance, Junction to Ambient (Note 1d) 34
R
θJA
Thermal Resistance, Junction to Ambient (Note 1e) 16
R
θJA
Thermal Resistance, Junction to Ambient (Note 1f) 19
R
θJA
Thermal Resistance, Junction to Ambient (Note 1g) 26
R
θJA
Thermal Resistance, Junction to Ambient (Note 1h) 61
R
θJA
Thermal Resistance, Junction to Ambient (Note 1i) 16
R
θJA
Thermal Resistance, Junction to Ambient (Note 1j) 23
R
θJA
Thermal Resistance, Junction to Ambient (Note 1k) 11
R
θJA
Thermal Resistance, Junction to Ambient (Note 1l) 13
NOTES:
1. R
θJA
is determined with the device mounted on a FR-4 board using a specified pad of 2 oz copper as shown below. R
θJC
is guaranteed by design while R
θCA
is determined
by the user's board design.
c. Still air, 20.9x10.4x12.7mm Aluminum Heat Sink, 1 in
2
pad of 2 oz copper
d. Still air, 20.9x10.4x12.7mm Aluminum Heat Sink, minimum pad of 2 oz copper
e. Still air, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, 1 in
2
pad of 2 oz copper
f. Still air, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, minimum pad of 2 oz copper
g. 200FPM Airflow, No Heat Sink,1 in
2
pad of 2 oz copper
h. 200FPM Airflow, No Heat Sink, minimum pad of 2 oz copper
i. 200FPM Airflow, 20.9x10.4x12.7mm Aluminum Heat Sink, 1 in
2
pad of 2 oz copper
j. 200FPM Airflow, 20.9x10.4x12.7mm Aluminum Heat Sink, minimum pad of 2 oz copper
k. 200FPM Airflow, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, 1 in
2
pad of 2 oz copper
l. 200FPM Airflow, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, minimum pad of 2 oz copper
2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%.
3. E
AS
of 45 mJ is based on starting T
J
= 25 °C, L = 0.4 mH, I
AS
= 15 A, V
DD
= 23 V, V
GS
= 10 V. 100% test at L = 0.1 mH, I
AS
= 23.8 A.
a. 38 °C/W when mounted on
a 1 in
2
pad of 2 oz copper
b. 81 °C/W when mounted on
a minimum pad of 2 oz copper
G
DF
DS
SF
SS
G
DF
DS
SF
SS