Datasheet

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3
©2011 Fairchild Semiconductor Corporation
FDMC7660DC Rev.C3
FDMC7660DC N-Channel Dual Cool
TM
PowerTrench
®
MOSFET
Thermal Characteristics
R
θJC
Thermal Resistance, Junction to Case (Top Source) 4.3
°C/W
R
θJC
Thermal Resistance, Junction to Case (Bottom Drain) 1.6
R
θJA
Thermal Resistance, Junction to Ambient (Note 1a) 42
R
θJA
Thermal Resistance, Junction to Ambient (Note 1b) 105
R
θJA
Thermal Resistance, Junction to Ambient (Note 1c) 29
R
θJA
Thermal Resistance, Junction to Ambient (Note 1d) 40
R
θJA
Thermal Resistance, Junction to Ambient (Note 1e) 19
R
θJA
Thermal Resistance, Junction to Ambient (Note 1f) 23
R
θJA
Thermal Resistance, Junction to Ambient (Note 1g) 30
R
θJA
Thermal Resistance, Junction to Ambient (Note 1h) 79
R
θJA
Thermal Resistance, Junction to Ambient (Note 1i) 17
R
θJA
Thermal Resistance, Junction to Ambient (Note 1j) 26
R
θJA
Thermal Resistance, Junction to Ambient (Note 1k) 12
R
θJA
Thermal Resistance, Junction to Ambient (Note 1l) 16
NOTES:
1. R
θJA
is determined with the device mounted on a FR-4 board using a specified pad of 2 oz copper as shown below. R
θJC
is guaranteed by design while R
θCA
is determined
by the user's board design.
c. Still air, 20.9x10.4x12.7mm Aluminum Heat Sink, 1 in
2
pad of 2 oz copper
d. Still air, 20.9x10.4x12.7mm Aluminum Heat Sink, minimum pad of 2 oz copper
e. Still air, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, 1 in
2
pad of 2 oz copper
f. Still air, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, minimum pad of 2 oz copper
g. 200FPM Airflow, No Heat Sink,1 in
2
pad of 2 oz copper
h. 200FPM Airflow, No Heat Sink, minimum pad of 2 oz copper
i. 200FPM Airflow, 20.9x10.4x12.7mm Aluminum Heat Sink, 1 in
2
pad of 2 oz copper
j. 200FPM Airflow, 20.9x10.4x12.7mm Aluminum Heat Sink, minimum pad of 2 oz copper
k. 200FPM Airflow, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, 1 in
2
pad of 2 oz copper
l. 200FPM Airflow, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, minimum pad of 2 oz copper
2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%.
3. E
AS
of 220 mJ is based on starting T
J
= 25
o
C; N-ch: L = 1 mH, I
AS
= 21 A, V
DD
= 27 V, V
GS
= 10 V. 100% test at L = 0.3 mH, I
AS
= 33.5 A.
4. As an N-ch device, the negative Vgs rating is for low duty cycle pulse ocurrence only. No continuous rating is implied.
5. I
SD
≤ 22 A, di/dt ≤ 100 A/μs, V
DD
≤ BV
DSS
, Starting T
J
= 25
o
C.
a. 42 °C/W when mounted on
a 1 in
2
pad of 2 oz copper
b. 105 °C/W when mounted on
a minimum pad of 2 oz copper