Datasheet

FDC6331L Rev D
Electrical Characteristics T
A
= 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BV
IN
Vin Breakdown Voltage V
ON/OFF
= 0 V, I
D
= –250 PA8 V
I
Load
Zero Gate Voltage Drain Current V
IN
= 6.4 V, V
ON/OFF
= 0 V –1 PA
I
FL
Leakage Current, Forward V
ON/OFF
= 0 V, V
IN
= 8 V –100 nA
I
RL
Leakage Current, Reverse V
ON/OFF
= 0 V, V
IN
= –8 V 100 nA
On Characteristics (Note 2)
V
ON/OFF (th)
Gate Threshold Voltage V
IN
= V
ON/OFF
, I
D
= –250 PA 0.4 0.9 1.5 V
R
DS(on)
Static Drain–Source
On–Resistance (Q2)
V
GS
= –4.5 V, I
D
= –2.8A
V
GS
= –2.5 V, I
D
= –2.5 A
V
GS
= –1.8 V, I
D
= –2.0 A
34
45
64
55
70
100
m:
R
DS(on)
Static Drain–Source
On–Resistance (Q1)
V
GS
= 4.5 V, I
D
= 0.4A
V
GS
= 2.7 V, I
D
= 0.2 A
3.1
3.8
4
5
:
Drain–Source Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous Drain–Source Diode Forward Current –0.6 A
V
SD
Drain–Source Diode Forward
Voltage
V
ON/OFF
= 0 V, I
S
= –0.6 A (Note 2) –1.2 V
Notes:
1. R
TJA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting
surface of the drain pins. R
TJC
is guar anteed by design while R
TJA
is determined by the user’s board design.
2. Pulse Test: Pulse Width < 300μs, Duty Cycle < 2.0%.
FDC6331L Load Switch Application Circuit
Q2
Q1
R1
IN
OUT
ON/OFF
LOAD
C1
R2
External Component Recommendation:
For additional in-rush current control, R2 and C1 can be added. For more information, see application note AN1030.
FDC6331L