Datasheet
FDC608PZ Rev B (W)
Electrical Characteristics T
A
= 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BV
DSS
Drain–Source Breakdown Voltage
V
GS
= 0 V, I
D
= –250 µA
–20 V
∆BVDSS
∆T
J
Breakdown Voltage Temperature
Coefficient
I
D
= –250 µA,Referenced to 25°C
–10
mV/°C
I
DSS
Zero Gate Voltage Drain Current V
DS
= –16 V, V
GS
= 0 V –1
µA
I
GSS
Gate–Body Leakage
V
GS
= ±12 V, V
DS
= 0 V
±10 µA
On Characteristics (Note 2)
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
, I
D
= –250 µA
–0.4 –1.0 –1.5 V
∆VGS(th)
∆T
J
Gate Threshold Voltage
Temperature Coefficient
I
D
= –250 µA,Referenced to 25°C
3
mV/°C
R
DS(on)
Static Drain–Source
On–Resistance
V
GS
= –4.5V, I
D
= –5.8 A
V
GS
= –2.5V, I
D
= –5.0 A
V
GS
= –4.5V,I
D
= –5.8A,T
J
=125°C
26
38
35
30
43
mΩ
I
D(on)
On–State Drain Current V
GS
= –4.5 V, V
DS
= –5 V –20 A
g
FS
Forward Transconductance V
DS
= –10 V, I
D
= –5.8 A 22 S
Dynamic Characteristics
C
iss
Input Capacitance 1330 pF
C
oss
Output Capacitance 270 pF
C
rss
Reverse Transfer Capacitance
V
DS
= –10 V, V
GS
= 0 V,
f = 1.0 MHz
230 pF
R
G
Gate Resistance V
GS
= 15 mV, f = 1.0 MHz 12
Ω
Switching Characteristics (Note 2)
t
d(on)
Turn–On Delay Time 13 24 ns
t
r
Turn–On Rise Time 8 16 ns
t
d(off)
Turn–Off Delay Time 91 145 ns
t
f
Turn–Off Fall Time
V
DD
= –10 V, I
D
= –1 A,
V
GS
= –4.5 V, R
GEN
= 6 Ω
60 96 ns
Q
g
Total Gate Charge 17 23 nC
Q
gs
Gate–Source Charge 3 nC
Q
gd
Gate–Drain Charge
V
DS
= –10 V, I
D
= –5.8 A,
V
GS
= –4.5 V
6 nC
Drain–Source Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous Drain–Source Diode Forward Current –1.3 A
V
SD
Drain–Source Diode Forward
Voltage
V
GS
= 0 V, I
S
= –1.3 A (Note 2) –0.7 –1.2 V
t
rr
Diode Reverse Recovery Time I
F
= –5.8 A, d
iF
/d
t
= 100A/µs 40 60 ns
Q
rr
Diode Reverse Recovery Charge I
F
= –5.8 A, d
iF
/d
t
= 100A/µs 15 23 nC
Notes:
1. R
θJA
is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface of the drain
pins. R
θJC
is guaranteed by design while R
θCA
is determined by the user's board design.
a. 78°C/W when mounted on a 1in
2
pad of 2oz copper on FR-4 board.
b. 156°C/W when mounted on a minimum pad.
2. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%
FDC608PZ