Datasheet

© 2007 Fairchild Semiconductor Corporation www.fairchildsemi.com
FAN3100C / FAN3100T • Rev. 1.0.5 2
FAN3100C / FAN3100T — Single 2 A High-Speed, Low-Side Gate Driver
Ordering Information
Part Number
Input
Threshold
Package Packing Method Quantity / Reel
FAN3100CMPX CMOS 6-Lead, 2x2 mm MLP Tape & Reel 3000
FAN3100CSX CMOS 5-Pin, SOT23 Tape & Reel 3000
FAN3100TMPX TTL 6-Lead, 2x2 mm MLP Tape & Reel 3000
FAN3100TSX TTL 5-Pin, SOT23 Tape & Reel 3000
Package Outlines
Figure 3. 6-Lead MLP (Top View) Figure 4. SOT23-5 (Top View)
Thermal Characteristics
(1)
Package

JL
(2)

JT
(3)

JA
(4)

JB
(5)

JT
(6)
Units
6-Lead, 2x2 mm Molded Leadless Package (MLP) 2.7 133 58 2.8 42 °C/W
SOT23-5 56 99 157 51 5 °C/W
Notes:
1. Estimates derived from thermal simulation; actual values depend on the application.
2. Theta_JL (
JL
): Thermal resistance between the semiconductor junction and the bottom surface of all the leads
(including any thermal pad) that are typically soldered to a PCB.
3. Theta_JT (
JT
): Thermal resistance between the semiconductor junction and the top surface of the package,
assuming it is held at a uniform temperature by a top-side heatsink.
4. Theta_JA (Θ
JA
): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking,
and airflow. The value given is for natural convection with no heatsink using a 2SP2 board, as specified in
JEDEC standards JESD51-2, JESD51-5, and JESD51-7, as appropriate.
5. Psi_JB (
JB
): Thermal characterization parameter providing correlation between semiconductor junction
temperature and an application circuit board reference point for the thermal environment defined in Note 4. For
the MLP-6 package, the board reference is defined as the PCB copper connected to the thermal pad and
protruding from either end of the package. For the SOT23-5 package, the board reference is defined as the PCB
copper adjacent to pin 2.
6. Psi_JT (
JT
): Thermal characterization parameter providing correlation between the semiconductor junction
temperature and the center of the top of the package for the thermal environment defined in Note 4.