Datasheet

© 2007 Fairchild Semiconductor Corporation www.fairchildsemi.com
FAN3100C / FAN3100T • Rev. 1.0.5 19
FAN3100C / FAN3100T — Single 2 A High-Speed, Low-Side Gate Driver
Physical Dimensions
TOP VIEW
0.05 C
0.05
C
2X
2X
2.0
2.0
PIN#1 IDENT
A
B
SIDE VIEW
RECOMMENDED
LAND PATTERN
BOTTOM VIEW
SEATING
PLANE
1
3
4
6
4
6
3
1
PIN #1 IDENT
0.65
1.30
1.21
0.52(6X)
0.90
0.42(6X)
0.65
2.25
1.68
(0.40)
(0.70)
NOTES:
A. PACKAGE DOES NOT FULLY CONFORM
TO JEDEC MO-229 REGISTRATION
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 2009.
D. LAND PATTERN RECOMMENDATION IS
EXISTING INDUSTRY LAND PATTERN.
E. DRAWING FILENAME: MKT-MLP06Krev5.
2.00±0.05
1.40±0.05
0.80±0.05
(0.20)4X
0.32±0.05
0.10 CAB
0.05
C
0.30±0.05
(6X)
(6X)
(0.60)
0.08
C
0.10
C
0.75±0.05
0.025±0.025
C
0.20±0.05
1.72
0.15
Figure 53. 2x2 mm, 6-Lead, Molded Leadless Package (MLP)
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Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
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http://www.fairchildsemi.com/packing_dwg/PKG-MLP06K.pdf