Datasheet

BSS123 Rev G(W)
Electrical Characteristics T
A
= 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BV
DSS
Drain–Source Breakdown Voltage
V
GS
= 0 V, I
D
= 250 µA
100 V
∆BVDSS
∆T
J
Breakdown Voltage Temperature
Coefficient
I
D
= 250 µA,Referenced to 25°C
97
mV/°C
I
DSS
Zero Gate Voltage Drain Current V
DS
= 100 V, V
GS
= 0 V 1
µA
V
DS
= 100 V,V
GS
= 0 V T
J
= 125°C
60
µA
V
DS
= 20 V, V
GS
= 0 V 10 nA
I
GSS
Gate–Body Leakage.
V
GS
= ±20 V, V
DS
= 0 V ±50
nA
On Characteristics (Note 2)
V
GS(th)
Gate Threshold Voltage V
DS
= V
GS
, I
D
= 1 mA 0.8 1.7 2 V
∆VGS(th)
∆T
J
Gate Threshold Voltage
Temperature Coefficient
I
D
= 1 mA,Referenced to 25°C
–2.7
mV/°C
R
DS(on)
Static Drain–Source
On–Resistance
V
GS
= 10 V, I
D
= 0.17 A
V
GS
= 4.5 V, I
D
= 0.17 A
V
GS
= 10 V, I
D
= 0.17 A, T
J
= 125°C
1.2
1.3
2.2
6
10
12
Ω
I
D(on)
On–State Drain Current V
GS
= 10 V, V
DS
= 5 V 0.68 A
g
FS
Forward Transconductance V
DS
= 10V, I
D
= 0.17 A 0.08 0.8 S
Dynamic Characteristics
C
iss
Input Capacitance 73 pF
C
oss
Output Capacitance 7 pF
C
rss
Reverse Transfer Capacitance
V
DS
= 25 V, V
GS
= 0 V,
f = 1.0 MHz
3.4 pF
R
G
Gate Resistance V
GS
= 15 mV, f = 1.0 MHz 2.2
Ω
Switching Characteristics (Note 2)
t
d(on)
Turn–On Delay Time 1.7 3.4 ns
t
r
Turn–On Rise Time 9 18 ns
t
d(off)
Turn–Off Delay Time 17 31 ns
t
f
Turn–Off Fall Time
V
DD
= 30 V, I
D
= 0.28 A,
V
GS
= 10 V, R
GEN
= 6 Ω
2.4 5 ns
Q
g
Total Gate Charge 1.8 2.5 nC
Q
gs
Gate–Source Charge 0.2 nC
Q
gd
Gate–Drain Charge
V
DS
= 30 V, I
D
= 0.22 A,
V
GS
= 10 V
0.3 nC
Drain–Source Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous Drain–Source Diode Forward Current 0.17 A
V
SD
Drain–Source Diode Forward
Voltage
V
GS
= 0 V, I
S
= 0.34 A(Note 2) 0.8 1.3 V
t
rr
Diode Reverse Recovery Time 11 nS
Q
rr
Diode Reverse Recovery Charge
I
F
= 0.17 A,
d
iF
/d
t
= 100 A/µs
3 nC
NOTE:
1. R
θJA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R
θJC
is guaranteed by design while R
θCA
is determined by the user's board design.
a) 350°C/W when mounted on a
minimum pad..
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%
BSS123