Datasheet

74LCX574 — Low Voltage Octal D-Type Flip-Flop with 5V Tolerant Inputs and Outputs
©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com
74LCX574 Rev. 1.6.1
74LCX574
Low Voltage Octal D-Type Flip-Flop
with 5V Tolerant Inputs and Outputs
Features
5V tolerant inputs and outputs
2.3V–3.6V V
CC
specifications provided
7.5ns t
PD
max. (V
CC
=
3.3V), 10µA I
CC
max.
Power down high impedance inputs and outputs
Supports live insertion/withdrawal
(1)
±24mA output drive (V
CC
=
3.0V)
Latch-up performance exceeds JEDEC 78 conditions
ESD performance
– Human body model
>
2000V
– Machine model
>
200V
Note:
1. To ensure the high impedance state during power up
or down, OE
should be tied to V
CC
through a pull-up
resistor: the minimum value of the resistor is
determined by the current-sourcing capability of the
driver.
General Description
The LCX574 is a high-speed, low power octal flip-flop
with a buffered common Clock (CP) and a buffered
common Output Enable (OE
). The information presented
to the D inputs is stored in the flip-flops on the LOW-to-
HIGH Clock (CP) transition.
The LCX574 is functionally identical to the LCX374
except for the pinouts.
The LCX574 is designed for low voltage applications
with capability of interfacing to a 5V signal environment.
The LCX574 is fabricated with an advanced CMOS
technology to achieve high speed operation while main-
taining CMOS low power dissipation.
Ordering Information
Note:
2. DQFN package available in Tape and Reel only.
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
Order
Number
Package
Number Package Description
74LCX574WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LCX574SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LCX574BQX
(2)
MLP20B 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MO-241, 2.5 x 4.5mm
74LCX574MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
74LCX574MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Implements
proprietary
noise/EMI reduction circuitry
December 2013

Summary of content (14 pages)