Datasheet
74LCX573 — Low Voltage Octal Latch with 5V Tolerant Inputs and Outputs
©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com
74LCX573 Rev. 1.6.1
74LCX573
Low Voltage Octal Latch with 5V Tolerant
Inputs and Outputs
Features
■
5V tolerant inputs and outputs
■
2.3V–3.6V V
CC
specifications provided
■
7.0 ns t
PD
max. (V
CC
= 3.3V), 10µA I
CC
max.
■
Power down high impedance inputs and outputs
■
Supports live insertion/withdrawal
(1)
■
±24mA output drive (V
CC
= 3.0V)
■
■
Latch-up performance exceeds JEDEC 78 conditions
■
ESD performance
– Human body model
>
2000V
– Machine model
>
200V
■
Leadless DQFN package
Note:
1. To ensure the high impedance state during power up
or down, OE should be tied to V
CC
through a pull-up
resistor: the minimum value of the resistor is
determined by the current-sourcing capability of the
driver.
General Description
The LCX573 is a high-speed octal latch with buffered
common Latch Enable (LE) and buffered common Out-
put Enable (OE
) input.
The LCX573 is functionally identical to the LCX373 but
has inputs and outputs on opposite sides.
The LCX573 is designed for low voltage applications
with capability of interfacing to a 5V signal environment.
The LCX573 is fabricated with an advanced CMOS
tech- nology to achieve high speed operation while
maintaining CMOS low power dissipation.
Ordering Information
Note:
2. DQFN package available in Tape and Reel only.
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
Order
Number
Package
Number Package Description
74LCX573WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LCX573SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LCX573BQX
(2)
MLP20B 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MO-241, 2.5 x 4.5mm
74LCX573MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
74LCX573MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Implements
proprietary
noise/EMI reduction circuitry
December 2013