Installation Guide

Table 423: Telecom Standards (continued)
ETSI EN 300 019 (Environmental for Telecommunications)
Table 424: IEEE 802.3 Media Access Standards
IEEE 802.3ab 1000BASE-T
Table 425: Environmental Data
Environmental standards EN/ETSI 300 019-2-1 v2.1.2 - Class 1.2 Storage
EN/ETSI 300 019-2-2 v2.1.2 - Class 2.3 Transportation
EN/ETSI 300 019-2-3 v2.1.2 - Class 3.1e Operational
EN/ETSI 300 753 (1997-10) - Acoustic Noise
ASTM D3580 Random Vibration Unpackaged 1.5G
Operating conditions Temperature range: 0° C to 40° C (32° F to 104° F)
Humidity: 10% to 93% relative humidity, non-condensing
Altitude: 0 to 3,000 meters (9,850 feet)
Shock (half sine): 30 m/s
2
(3 G), 11 ms, 60 shocks
Random vibration: 3 to 500 Hz @ 1.5 G rms
Storage & transportation
conditions (packaged)
Transportation temperature: -40° C to 70° C (-40° F to 158° F)
Storage and transportation humidity: 10% to 95% relative humidity,
non-condensing
Packaged shock (half sine): 180 m/s
2
(18 G), 6 ms, 600 shocks
Packaged sine vibration: 5 to 62 Hz @ velocity 5 mm/s,
62 to 500 Hz @ 0.2 G
Packaged random vibration: 5 to 20 Hz @ 1.0 ASD w/–3 dB/oct.
from 20 to 200 Hz
14 drops minimum on sides & corners @ 42 inches (<15 kg box)
Note
For the technical specifications of power supplies for the Summit X650 series switches, see
Summit 850 W Power Supplies Technical Specifications on page 643.
Summit X670 Series Switches Technical Specifications
The Summit X670 series includes the following switches:
• Summit X670-48x switch (17103, 17103C, 17104)
• Summit X670V-48x switch (17101, 17102)
• Summit X670V-48t switch (17201, 17202, 17203, 17204, 17205, 17206)
Note
The 17103C Teradyne X670-48x-FB-AC consists of one (17103) X670-48x 48 10GBASE-X SFP+
with three front-to-back airflow fan modules and two (10925) 550W AC Power Supplies with
front-to-back airflow.
Technical Specifications Summit X670 Series Switches Technical Specifications
Summit Family Hardware Installation Guide 615