Datasheet

DATASHEET
Shuen  1W Series
22
Copyright © 2011, Everlight All Rights Reserved. Release Date : 03232011. Issue No: DHE-0000751
www.everlight.com
Reflow Soldering Characteristics
For Reflow Process
a. ELSH series are suitable for SMT processes.
b. Curing of glue in oven must be according to standard operation flow processes.
c. Reflow soldering should not be done more than twice.
d. In soldering process, stress on the LEDs during heating should be avoided.
e. After soldering, do not bend the circuit board.